NAND

When Samsung released its 750 EVO lineup of SSDs based on planar TLC NAND flash memory earlier this year, it seemed like a big surprise, as the company was first to ramp up production of 3D NAND memory and to use it for SSDs. Apparently, Samsung not only decided to expand the lineup with a 500 GB model, but also to make such drives available worldwide and even change their positioning. Earlier this year Samsung introduced its 750 EVO drives with 120 GB (MZ-750120BW) and 250 GB (MZ-750250BW) capacities, which are based on simplified version of the company’s MGX controller with only two cores and TLC NAND chips produced using 16 nm fabrication process. The drives are equipped with 256 MB of DRAM cache, AES-256...

Market Trends Q1 2016: Shipments of SSDs Up 32.7% Year-over-Year

Shipments of SSDs in the first quarter of 2016 were up 32.7% compared to the same period a year ago, according to findings of TrendFocus*, a storage market tracking...

10 by Anton Shilov 6 days ago

Western Digital’s Acquisition of SanDisk Officially Closes

Western Digital announced on Tuesday that the Chinese authorities have approved its acquisition of SanDisk. The regulatory approval from China's Ministry of Commerce (MOFCOM) in connection with the planned...

18 by Anton Shilov on 5/16/2016

Plextor Embraces TLC NAND: Introduces M7V SSD

After toying with the concept last year, Plextor has finally announced its first family of SSDs based on TLC NAND flash memory. The new M7V lineup of drives is...

21 by Anton Shilov on 4/12/2016

Toshiba to Build New Fab to Produce BiCS NAND Flash

Toshiba this month has announced plans to build a new manufacturing facility to produce its BiCS NAND flash memory. The company intends to start making chips at the new...

5 by Anton Shilov on 3/25/2016

Samsung Demos Its First BGA SSD: 1500 MB/s Read Speed and Tiny Package

In the recent years SSDs in M.2 form-factor have greatly reduced the amount of space required for storage sub-systems inside modern PCs. However, as computers get even smaller, there...

38 by Anton Shilov on 3/22/2016

SD Association Announces SD 5.0 Specification: SD Cards For UHD and 360° Video Capture

The SD Association, the multi-vendor consortium responsible for developing standards for Secure Digital flash memory cards, has unveiled the newest version of the Secure Digital standard, SD 5.0. The...

14 by Anton Shilov on 3/1/2016

Samsung SSD Update: 48-layer 256Gbit TLC 3D NAND & Three New TLC SSDs Announced

When Samsung took the stage at the 2015 Flash Memory Summit, they admittedly didn't deliver any bombshell announcements on the scale of the Intel/Micron 3D XPoint surprise, but they...

61 by Billy Tallis on 8/13/2015

Toshiba Brings Through-Silicon Vias to NAND Flash

At Flash Memory Summit this week, Toshiba is showing off a NAND flash device packaged using through-silicon vias rather than traditional wire-bonded connections. The NAND flash currently on the market...

18 by Billy Tallis on 8/12/2015

Toshiba and SanDisk Announce 48-layer 256Gbit TLC 3D NAND

This week Toshiba and SanDisk are announcing a new milestone in their joint development of flash memory. Back in March Toshiba announced a 48-layer 3D NAND technology that they...

29 by Billy Tallis on 8/4/2015

Estimating Intel-Micron 32-layer 3D NAND Die Size

Yesterday Intel and Micron shared some new details of their 3D NAND technology and during the presentation they also showed a production wafer. I missed the wafer during the...

36 by Kristian Vättö on 3/27/2015

Intel-Micron Share Additional Details of Their 3D NAND

Today must be the busiest day in the world of NAND. Earlier today, Toshiba announced that it has begun sampling of its 48-layer 128Gbit 3D NAND part and now...

35 by Kristian Vättö on 3/26/2015

Toshiba Announces 48-layer 128Gbit 3D NAND - Samples Shipping Today

The 3D NAND race is heating up. Samsung has been shipping its 3D NAND products for over six months now, but so far we have known very little about...

13 by Kristian Vättö on 3/26/2015

The State of SanDisk

Back at Flash Memory Summit I had the opportunity to meet with all the key people at SanDisk. There is a lot going on at SanDisk at the moment...

132 by Kristian Vättö on 12/5/2014

Intel's 3D NAND to Ship in H2'15: 256Gbit Die & 32 Layers

Last Thursday in its annual Investor Meeting Intel revealed the first details of its 3D NAND technology and announced that it will begin the shipments of 3D NAND in...

58 by Kristian Vättö on 11/25/2014

Encryption and Storage Performance in Android 5.0 Lollipop

As alluded to in our Nexus 6 review, our normal storage performance benchmark was no longer giving valid results as of Android 5.0. While Androbench was not a perfect...

93 by Brandon Chester & Joshua Ho on 11/20/2014

Measuring Toshiba's 15nm 128Gbit MLC NAND Die Size

Courtesy of Custom PC Review At Flash Memory Summit, Toshiba was showcasing their latest 15nm 128Gbit MLC NAND wafer that has been developed in partnership with SanDisk. I simply could...

12 by Kristian Vättö on 8/22/2014

Toshiba and Qualcomm Set to Introduce UFS 2.0 Solutions in 2014

Since they first started showing up on the market, most smartphones and tablets have used eMMC flash storage. While in some ways similar to the NAND flash used in...

8 by Jarred Walton on 1/14/2014

Micron Announces 16nm 128Gb MLC NAND, SSDs in 2014

Earlier today Micron announced its first 16nm MLC NAND device. The 128Gbit device is architecturally identical to the current 20nm/128Gbit 2-bit-per-cell MLC device that's shipping today but smaller. That...

10 by Anand Lal Shimpi on 7/16/2013

Intel SSD 335 (240GB) Review

Back in February, Intel released its first SandForce based SSD: the Intel SSD 520. Since then Intel's SSD lineup has evolved. A couple of months after the 520's release...

70 by Kristian Vättö on 10/29/2012

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