NAND

When Samsung took the stage at the 2015 Flash Memory Summit, they admittedly didn't deliver any bombshell announcements on the scale of the Intel/Micron 3D XPoint surprise, but they still had a lot to talk about. We knew that Samsung's third generation of V-NAND/3D NAND was on the way with mass production scheduled for the second half of this year. Samsung has now disclosed that mass production is starting this month, and that it's a 48-layer design with a 256Gb TLC being the first die announced. Samsung's current second-generation 3D NAND is a 32-layer design available as 128Gb TLC or 128Gb MLC. With mass production imminent, Samsung has ensured that neither SK Hynix nor the Toshiba/SanDisk joint venture will be able to leapfrog them with their...

Toshiba Brings Through-Silicon Vias to NAND Flash

At Flash Memory Summit this week, Toshiba is showing off a NAND flash device packaged using through-silicon vias rather than traditional wire-bonded connections. The NAND flash currently on the market...

18 by Billy Tallis on 8/12/2015

Toshiba and SanDisk Announce 48-layer 256Gbit TLC 3D NAND

This week Toshiba and SanDisk are announcing a new milestone in their joint development of flash memory. Back in March Toshiba announced a 48-layer 3D NAND technology that they...

28 by Billy Tallis on 8/4/2015

Estimating Intel-Micron 32-layer 3D NAND Die Size

Yesterday Intel and Micron shared some new details of their 3D NAND technology and during the presentation they also showed a production wafer. I missed the wafer during the...

36 by Kristian Vättö on 3/27/2015

Intel-Micron Share Additional Details of Their 3D NAND

Today must be the busiest day in the world of NAND. Earlier today, Toshiba announced that it has begun sampling of its 48-layer 128Gbit 3D NAND part and now...

35 by Kristian Vättö on 3/26/2015

Toshiba Announces 48-layer 128Gbit 3D NAND - Samples Shipping Today

The 3D NAND race is heating up. Samsung has been shipping its 3D NAND products for over six months now, but so far we have known very little about...

13 by Kristian Vättö on 3/26/2015

The State of SanDisk

Back at Flash Memory Summit I had the opportunity to meet with all the key people at SanDisk. There is a lot going on at SanDisk at the moment...

132 by Kristian Vättö on 12/5/2014

Intel's 3D NAND to Ship in H2'15: 256Gbit Die & 32 Layers

Last Thursday in its annual Investor Meeting Intel revealed the first details of its 3D NAND technology and announced that it will begin the shipments of 3D NAND in...

58 by Kristian Vättö on 11/25/2014

Encryption and Storage Performance in Android 5.0 Lollipop

As alluded to in our Nexus 6 review, our normal storage performance benchmark was no longer giving valid results as of Android 5.0. While Androbench was not a perfect...

93 by Brandon Chester & Joshua Ho on 11/20/2014

Measuring Toshiba's 15nm 128Gbit MLC NAND Die Size

Courtesy of Custom PC Review At Flash Memory Summit, Toshiba was showcasing their latest 15nm 128Gbit MLC NAND wafer that has been developed in partnership with SanDisk. I simply could...

12 by Kristian Vättö on 8/22/2014

Toshiba and Qualcomm Set to Introduce UFS 2.0 Solutions in 2014

Since they first started showing up on the market, most smartphones and tablets have used eMMC flash storage. While in some ways similar to the NAND flash used in...

8 by Jarred Walton on 1/14/2014

Micron Announces 16nm 128Gb MLC NAND, SSDs in 2014

Earlier today Micron announced its first 16nm MLC NAND device. The 128Gbit device is architecturally identical to the current 20nm/128Gbit 2-bit-per-cell MLC device that's shipping today but smaller. That...

10 by Anand Lal Shimpi on 7/16/2013

Intel SSD 335 (240GB) Review

Back in February, Intel released its first SandForce based SSD: the Intel SSD 520. Since then Intel's SSD lineup has evolved. A couple of months after the 520's release...

70 by Kristian Vättö on 10/29/2012

SandForce Demos 19nm Toshiba & 20nm IMFT NAND Flash

SandForce's controllers have fairly broad compatibility with NAND available on the market today. It shouldn't be a surprise that the first demo we saw of Toshiba's 19nm and Intel/Micron's...

20 by Anand Lal Shimpi on 6/8/2012

Intel Sells Some of Its IMFT Stake to Micron

Intel and Micron today announced that they have done some modifications to their agreements on their IMFT joint venture. In short, Intel is selling its stake in two fabs...

6 by Kristian Vättö on 2/28/2012

Intel and Micron (IMFT) Announce World's First 128Gb 20nm MLC NAND

Earlier this year, Intel and Micron's joint NAND manufacturing venture (IMFT) announced it had produced 64Gb (8GB) MLC NAND on a 20nm process. Most IMFT NAND that's used in...

36 by Anand Lal Shimpi on 12/6/2011

SanDisk-Toshiba Take Back The Crown With A Different Kind of NAND

After 11 years of partnership, Sandisk and Toshiba's timing could not have been better. Just seven days after losing the NAND crown to Intel and Micron (IMFT) they announce...

35 by Jason Inofuentes on 5/5/2011

Intel & Micron Announce First 20nm MLC NAND Flash for Use in SSDs

We just started testing SSDs based on IMFT 25nm NAND Flash and look at what Intel/Micron just announced? The first 8GB MLC NAND device built on a 20nm process...

42 by Anand Lal Shimpi on 4/14/2011

Micron's ClearNAND: 25nm + ECC, Combats Increasing Error Rates

NAND endurance is on its way down with each subsequent process generation. At the same time unrecoverable bit error rates are on their way up. Companies like SandForce have...

24 by Anand Lal Shimpi on 12/2/2010

Log in

Don't have an account? Sign up now