HBM
SK Hynix and AMD were at the forefront of the memory industry with the first generation of high bandwidth memory (HBM) back in 2013 – 2015, and SK Hynix is still leading this market in terms of share. In a bid to maintain and grow its position, SK Hynix has to adapt to the requirements of its customers, particularly in the AI space, and to do so it's mulling over how to make 'differentiated' HBM products for large customers. "Developing customer-specific AI memory requires a new approach as the flexibility and scalability of the technology becomes critical," said Hoyoung Son, the head of Advanced Package Development at SK Hynix in the status of a vice president When it comes to performance, HBM memory with a 1024-bit...
Samsung Launches 12-Hi 36GB HBM3E Memory Stacks with 10 GT/s Speed
Samsung announced late on Monday the completion of the development of its 12-Hi 36 GB HBM3E memory stacks, just hours after Micron said it had kicked off mass production...
4 by Anton Shilov on 2/27/2024Micron Kicks Off Production of HBM3E Memory
Micron Technology on Monday said that it had initiated volume production of its HBM3E memory. The company's HBM3E known good stack dies (KGSDs) will be used for Nvidia's H200...
7 by Anton Shilov on 2/26/2024Samsung Announces 'Shinebolt' HBM3E Memory: HBM Hits 36GB Stacks at 9.8 Gbps
Samsung’s annual Memory Tech Day is taking place in San Jose this morning, and as part of the event, the company is making a couple of notable memory technology...
10 by Ryan Smith on 10/20/2023HBM4 in Development, Organizers Eyeing Even Wider 2048-Bit Interface
High-bandwidth memory has been around for about a decade, and throughout its its continued development it has steadily increased in speed, starting at a data transfer rate from 1...
11 by Anton Shilov on 10/12/2023Micron to Ship HBM3E Memory to NVIDIA in Early 2024
Micron has reaffirmed plans to start shipments of its HBM3E memory in high volume in early 2024, while also revealing that NVIDIA is one of its primary customers for...
7 by Anton Shilov on 9/28/2023Memory Makers on Track to Double HBM Output in 2023
TrendForce projects a remarkable 105% increase in annual bit shipments of high-bandwidth memory (HBM) this year. This boost comes in response to soaring demands from AI and high-performance computing...
9 by Anton Shilov on 8/9/2023Micron Publishes Updated DRAM Roadmap: 32 Gb DDR5 DRAMs, GDDR7, HBMNext
In addition to unveiling its first HBM3 memory products yesterday, Micron also published a fresh DRAM roadmap for its AI customers for the coming years. Being one of the...
4 by Anton Shilov on 7/27/2023Micron Unveils HBM3 Gen2 Memory: 1.2 TB/sec Memory Stacks For HPC and AI Processors
Micron today is introducing its first HBM3 memory products, becoming the latest of the major memory manufacturers to start building the high bandwidth memory that's widely used in server-grade...
7 by Anton Shilov on 7/26/2023As The Demand for HBM Explodes, SK Hynix is Expected to Benefit
The demand for high bandwidth memory is set to explode in the coming quarters and years due to the broader adoption of artificial intelligence in general and generative AI...
9 by Anton Shilov on 4/18/2023Intel Showcases Sapphire Rapids Plus HBM Xeon Performance at ISC 2022
Alongside today’s disclosure of the Rialto Bridge accelerator, Intel is also using this week’s ISC event to deliver a brief update on Sapphire Rapids, the company’s next-generation Xeon CPU...
22 by Ryan Smith on 5/31/2022Intel to Launch Next-Gen Sapphire Rapids Xeon with High Bandwidth Memory
As part of today’s International Supercomputing 2021 (ISC) announcements, Intel is showcasing that it will be launching a version of its upcoming Sapphire Rapids (SPR) Xeon Scalable processor with...
150 by Dr. Ian Cutress on 6/28/20212023 Interposers: TSMC Hints at 3400mm2 + 12x HBM in one Package
High-performance computing chip designs have been pushing the ultra-high-end packaging technologies to their limits in the recent years. A solution to the need for extreme bandwidth requirements in the...
35 by Andrei Frumusanu on 8/25/2020Micron to Launch HBM2 DRAM This Year: Finally
Bundled in their latest earnings call, Micron has revealed that later this year the company will finally introduce its first HBM DRAM for bandwidth-hungry applications. The move will enable...
14 by Anton Shilov on 3/27/2020AMD Discusses ‘X3D’ Die Stacking and Packaging for Future Products: Hybrid 2.5D and 3D
One of AMD’s key messages at its Financial Analyst Day 2020 is that the company wants to remain on the leading edge when it comes to process node technology...
12 by Dr. Ian Cutress on 3/5/2020SK Hynix Licenses DBI Ultra Interconnect for Next-Gen 3DS and HBM DRAM
SK Hynix has inked a new broad patent and technology licensing agreement with Xperi Corp. Among other things, the company licensed the DBI Ultra 2.5D/3D interconnect technology developed by...
9 by Anton Shilov on 2/11/2020Samsung Develops 12-Layer 3D TSV DRAM: Up to 24 GB HBM2
Samsung on Monday said that it had developed the industry’s first 12-layer 3D packaging for DRAM products. The technology uses through silicon vias (TSVs) to create high-capacity HBM memory...
11 by Anton Shilov on 10/7/2019Samsung HBM2E ‘Flashbolt’ Memory for GPUs: 16 GB Per Stack, 3.2 Gbps
Samsung has introduced the industry’s first memory that correspond to the HBM2E specification. The company’s new Flashbolt memory stacks increase performance by 33% and offer double per-die as well...
25 by Anton Shilov on 3/20/2019JEDEC Updates HBM Spec to Boost Capacity & Performance: 24 GB, 307 GB/s Per Stack
JEDEC this week published an updated version of its JESD235 specification, which describes HBM and HBM2 DRAM. The new version of the standard allows memory manufacturers to increase capacities...
15 by Anton Shilov on 12/19/2018Xilinx Announces Project Everest: The 7nm FPGA SoC Hybrid
This week Xilinx is making public its latest internal project for the next era of specialized computing. The new product line, called Project Everest in the interim, is based...
16 by Ian Cutress on 3/19/2018