Broadwell CPU Architecture

We’ll kick off our look at Broadwell-Y with Broadwell’s CPU architecture. As this is a preview Intel isn’t telling us a great deal about the CPU at this time, but they have given us limited information about Broadwell’s architectural changes and what to expect for performance as a result.

With Broadwell Intel is at the beginning of the next cycle of their tick-tock cadence. Whereas tock products such as Haswell and Sandy Bridge designed to be the second generation of products to use a process node and as a result are focused on architectural changes, tick products such as Ivy Bridge and now Broadwell are the first generation of products on a new process node and derive much (but not all) of their advantage from manufacturing process improvements. Over the years Intel has wavered on just what a tick should contain – it’s always more than simply porting an architecture to a new process node – but at the end of the day Broadwell is clearly derived from Haswell and will be taking limited liberties in improving CPU performance as a result.

Intel's Tick-Tock Cadence
Microarchitecture Process Node Tick or Tock Release Year
Conroe/Merom 65nm Tock 2006
Penryn 45nm Tick 2007
Nehalem 45nm Tock 2008
Westmere 32nm Tick 2010
Sandy Bridge 32nm Tock 2011
Ivy Bridge 22nm Tick 2012
Haswell 22nm Tock 2013
Broadwell 14nm Tick 2014
Skylake 14nm Tock 2015

All told, Intel is shooting for a better than 5% IPC improvement over Haswell. This is similar to Ivy Bridge (4%-6%), though at this stage in the game Intel is not talking about expected clockspeeds or the resulting overall performance improvement. Intel has made it clear that they don’t regress on clockspeeds, but beyond that we’ll have to wait for further product details later this year to see how clockspeeds will compare.

To accomplish this IPC increase Intel will be relying on a number of architectural tweaks in Broadwell. Chief among these are bigger schedulers and buffers in order to better feed the CPU cores themselves. Broadwell’s out-of-order scheduling window for example is being increased to allow for more instructions to be reordered, thereby improving IPC. Meanwhile the L2 translation lookaside buffer (TLB) is being increased from 1K to 1.5K entries to reduce address translation misses.

The TLBs are also receiving some broader feature enhancements that should again improve performance. A second miss handler is being added for TLB pages, allowing Broadwell to utilize both handlers at once to walk memory pages in parallel. Otherwise the inclusion of a 1GB page mode should pay off particularly well for servers, granting Broadwell the ability to handle these very large pages on top of its existing 2MB and 4K pages.

Meanwhile, as is often the case Intel is once again iterating on their branch predictor to cut down on missed branches and unnecessary memory operations. Broadwell’s branch predictor will see its address prediction improved for both branches and returns, allowing for more accurate speculation of impending branching operations.

Of course efficiency increases can only take you so far, so along with the above changes Intel is also making some more fundamental improvements to Broadwell’s math performance. Both multiplication and division are receiving a performance boost thanks to performance improvements in their respective hardware. Floating point multiplication is seeing a sizable reduction in instruction latency from 5 cycles to 3 cycles, and meanwhile division performance is being improved by the use of an even larger Radix-1024 (10bit) divider. Even vector operations will see some improvements here, with Broadwell implementing a faster version of the vector Gather instruction.

Finally, while it’s not clear whether these will be part of AES-NI or another instruction subset entirely, Intel is once again targeting cryptography for further improvements. To that end Broadwell will bring with it improvements to multiple cryptography instructions.

Meanwhile it’s interesting to note that in keeping with Intel’s power goals for Broadwell, throughout all of this Intel put strict power efficiency requirements in place for any architecture changes. Whereas Haswell was roughly a 1:1 ratio of performance to power – a 1% increase in performance could cost no more than a 1% increase in power consumption – Broadwell’s architecture improvements were required to be at 2:1. While a 2:1 mandate is not new – Intel had one in place for Nehalem too – at the point even on the best of days meaningful IPC improvements are hard to come by at 1:1, never mind 2:1. The end result no doubt limited what performance optimizations Intel could integrate into Broadwell’s design, but it also functionally reduces power requirements for any given performance level, furthering Intel’s goals in getting Core performance in a mobile device. In the case of Broadwell this means Broadwell’s roughly 5% performance improvement comes at a cost of just a 2.5% increase in immediate power consumption.

With that said, Intel has also continued to make further power optimizations to the entire Broadwell architecture, many of which will be applicable not just to Core M but to all future Broadwell products. Broadwell will see further power gating improvements to better shut off parts of the CPU that are not in use, and more generalized design optimizations have been made to reduce power consumption of various blocks as is appropriate. These optimizations coupled with power efficiency gains from the 14nm process are a big part of the driving force in improving Intel’s power efficiency for Core M.

Intel Broadwell Architecture Preview Broadwell GPU Architecture
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  • sherlockwing - Monday, August 11, 2014 - link

    Tskin=41C?!? Is Intel out of their mind? Did they not read how much trouble iPad 3 got into for a Tskin of 33.6C? http://www.theguardian.com/technology/2012/mar/20/...

    I hope they/OEMs do keep Tskin undercontrol with better throttling when actually shipping these chips in products.
  • ZeDestructor - Monday, August 11, 2014 - link

    People are cool with high TSkins on their devices. I know my phone passes 35°C easily if I load it up, and I'm fine with that. Then again, I'm completely fine with a 60°C idle, because that's where ICs like to live...
  • Gondalf - Saturday, August 23, 2014 - link

    Ummmm present iPad Air scores a 42.1°C skin temperature with an A7 running inside.
    So not a concern, all recent tablets are pretty hot.
  • magnusmundus - Monday, August 11, 2014 - link

    Looking forward to seeing benchmarks and desktop 14nm parts.

    Also, I found a typo on the closing thoughts page "Though laptops at a category" should be "Though laptops as a category"
  • DanNeely - Monday, August 11, 2014 - link

    I'm surprised they didn't move the PCH to 22nm. Relatively low power consumption or not, they pushed everything else to the wall to get Core M's TDP as low as possible and between doing custom designs for it anyway and soft sales meaning they've got the spare 22nm capacity available I don't see any obvious reason why they couldn't've done so.
  • klmccaughey - Monday, August 11, 2014 - link

    Vastly diminishing returns for the expense seem the most likely answer to that.
  • mkozakewich - Thursday, August 14, 2014 - link

    The process nodes are very expensive to produce, so they need to get as much life out of them as possible. Also, a new(er) process isn't going to have a high enough yield. 22 Might have worked, but I bet the older process gave them a better bang for their buck.
  • Flunk - Monday, August 11, 2014 - link

    I was thinking of buying one of these, but it sounds like the focus is still on TDP over all else so it looks like waiting to Skylake is the plan for anyone with Sandy Bridge or newer.
  • klmccaughey - Monday, August 11, 2014 - link

    Yup :( Is there no hope for us gamers?
  • wurizen - Monday, August 11, 2014 - link

    i think AMD is your hope. if you don't have a sandy bridge cpu or in phenom land, an FX series cpu is a great cpu that will hold one over until AMD updates their desktop FX series line of cpu's. i mean a 990FX mobo has all you need. i think pci 2.0 is still adequate for today's video cards so that doesn't really matter. even though on paper, intel has pci 3.0 and usb 5.0 (just kidding) and thunderbolt 9.9, they're superflous and doesn't make you game better. i mean, an fx-8350 with a decent gpu should give one smooth framerates. i mean who cares if in the benchmark, an fx-8350 with so and so gpu will run so and so game at, say 120fps, while an intel chip will run it at 190fps? 120 fps is like very good and that person who has an intel chip running 190 fps probably paid hundreds of dollars more for their system and i bet they wouldn't be even to decipher those 70 or so of more frames. i mean, it's not total fps that matters but the average frame rate and i think an fx-8350 will deliver that. it's a beast of a cpu. and broadwell? who cares. 90% of the words in the article above are buzz tech fancy words to get gadget heads salivating and stock wigs greasing their palms.

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