Memory Performance: 16GB DDR3-1333 to DDR3-2400 on Ivy Bridge IGP with G.Skill
by Ian Cutress on October 18, 2012 12:00 PM EST- Posted in
- Memory
- G.Skill
- Ivy Bridge
- DDR3
The realm of DDR3-2400 MHz memory is reserved for two types of setup – strong Sandy Bridge and Sandy Bridge-E processors, or Ivy Bridge processors. The former can depend on the motherboard as well – within my motherboard testing I was finding that some motherboards enjoyed running at DDR3-2400 with an appropriate processor, whereas others needed a bump in voltages to get to work. For Ivy Bridge processors though, DDR3-2400 should be a walk in the park – based on overclocking results it seems that processors produced in Malaysia have good memory controllers, whereas ones made in Costa Rica have better processor speed/voltage characteristics (though your mileage may vary). So having a high and stable memory speed is ideally paired with an Ivy Bridge processor at this point.
As you can imagine, if DDR3-2133 was getting expensive, then DDR3-2400 is even much more so, even if the kit is rated C10 rather than C9. The additional cost comes mainly from binning – i.e. making sure that there are enough ICs to go into these memory kits. A 4x4 GB kit needs 32 ICs capable of running this speed, and to get those 32 may require north of 500 ICs to be tested (the rest get binned into other slower modules), though the exact numbers are obviously a well kept secret from G.Skill. If I recall, in the early days of Nehalem, the high end 2000 C8 modules were literally 1 in 100 that passed the tests, and hence the exorbitant price at the time. This DDR3-2400 C10 kit comes in at $145, not much of a leap from DDR3-2133 C9 at $130, but the benchmarks will paint a truer picture of how much this difference matters later in the review.
Visual Inspection
The DDR3-2400 C10 kit today provided by G.Skill covers its TridentX branding. TridentX is one notch above RipjawsZ, and spans kits from DDR3-2400 C9 to DDR3-2800 C11. The main features on the kit (aside from the speeds) are the heatsinks, to which G.Skill have added a detachable fin. Without the fin, the module is approximately 9mm above the module, and with the fin the total height is 22mm above the PCB. That is a lot of height for a memory module that in 99% of circumstances would not produce enough temperature to trouble any build.
In order to remove the fin there is a screw at each end of the module, and the fin slides off effortlessly. The fins fit very well, but upon attempting to reattach a fin I was unable to get it on as securely as it came out of the box, leaving a little wobble in the fin. There is no cause for alarm if you get a module with a wobbly fin – nothing is wrong, and it will not affect the heat dissipation as much as most users may think. Most modules output a few watts at best, so dissipation of several watts of energy without a fin is simple enough.
Putting such a large module in our TRUE Copper scenario was a recipe for disaster:
Even putting the module in the second slot faired no better:
All the testing for this review was done on a ASUS P8Z77-V Premium motherboard with the Intel stock cooler, so module movement is not much an issue in that case, but big air coolers still get a lot of usage (and is more often than not an investment over several updates), so there are things to consider when purchasing memory.
JEDEC + XMP Settings
| G.Skill | |||||
| Kit Speed | 1333 | 1600 | 1866 | 2133 | 2400 |
| Subtimings | 9-9-9-24 2T | 9-9-9-24 2T | 9-10-9-28 2T | 9-11-10-28 2T | 10-12-12-31 2T |
| Price | $75 | $80 | $95 | $130 | $145 |
| XMP | No | Yes | Yes | Yes | Yes |
| Size | 4 x 4 GB | 4 x 4 GB | 4 x 4 GB | 4 x 4 GB | 4 x 4 GB |
|
|
|||||
| MHz | 1333 | 1600 | 1867 | 2134 | 2401 |
| Voltage | 1.500 | 1.500 | 1.500 | 1.650 | 1.650 |
| tCL | 9 | 9 | 9 | 9 | 10 |
| tRCD | 9 | 9 | 10 | 11 | 12 |
| tRP | 9 | 9 | 9 | 10 | 12 |
| tRAS | 24 | 24 | 28 | 28 | 31 |
| tRC | 33 | 33 | 37 | 38 | 43 |
| tWR | 10 | 12 | 14 | 16 | 16 |
| tRRD | 4 | 5 | 5 | 6 | 7/6 |
| tRFC | 107 | 128 | 150 | 171 | 313 |
| tWTR | 5 | 6 | 8/7 | 9/8 | 10/9 |
| tRTP | 5 | 6 | 8/7 | 9/8 | 10/9 |
| tFAW | 20 | 24 | 24 | 25 | 26 |
| tCWL | - | 7 | 7 | 7 | 7 |
| CR | - | 2 | 2 | 2 | 2 |
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Peanutsrevenge - Friday, October 19, 2012 - link
Thanks Ian.Well, except for making me feel ludicrously old, first memory kit of 4GB DDR2?
Mine was back in SIMM days, when I think I added an 8MB 72pin stick to my existing 4MB stick.
Although the external math co-processor might have come first.
And I'm only 31.
You shall now always be Dr Evil Cutress to me.
IanCutress - Friday, October 19, 2012 - link
First *purchased* memory kit. I dealt with plenty of older memory thanks to hand me downs or prebuilt systems from my family at the time. I still have some SDRAM around somewhere, or some 8MB sticks of something or other. It's in a box under the desk ;)Haha, I've been called worse :D
Ian
alpha754293 - Friday, October 19, 2012 - link
I would have figured that with a memory test/benchmarking that you would be running Stream test.And with all this talk about the various latencies (measured in clock cycles) - a) a comparison should be given between the theorectical calculations and the actual performance and b) that you would think that you'd use something like lmbench in order to try to better quantify/test that (in addition to the actual games, tools, and applications).
Most of the results are pretty much inconclusive since the standard deviation is within the margin of error.
IanCutress - Friday, October 19, 2012 - link
Main reason is to steer away from synthetics. Synthetics frustrate me so - they will easily show the difference between a 1600 C9 and 2400 C10 kit, but what is that difference in real life? If latencies and burst speeds are x% difference in the synthetic, does that actually make a difference when playing Portal 2? Hence the requirement of this review to focus on the practical rather than the synthetic.Regarding being within standard deviations, the results you see are the culmination of multiple tests. The standard deviations are actually quite low as the results are enormously repeatable. I did a science doctorate, I make sure my numbers are valid.
Ian
Tchamber - Friday, October 19, 2012 - link
Back in 2009 I picked up a 3x2GB kit of Mushkin DDR3 1600 with timings of 6-7-6-18. Why don't we see low latency like that any more?IanCutress - Friday, October 19, 2012 - link
Those were linked to different types of memory chips at the time - the Elpida 'Hyper' ICs (http://www.anandtech.com/show/2799). Nice speeds, but high fail rates and low yields. They have been replaced by chips that are slightly slower, but a lot more reliable. Also to note that those Elpida Hyper kits worked great with Clarkdale and Nehalem, but are poor with Sandy Bridge and Ivy Bridge.Ian
CherryBOMB - Friday, October 19, 2012 - link
Can you explain why you say Hyper' IC's are " are poor with Sandy Bridge and Ivy Bridge."As I stated "I have 16gb of the fastest money could buy around that era running on x79 @ 1666 6-6-6-18-1t right now."
This was a tri channel run >
http://www.overclock.net/t/872945/top-30-3d-mark-1...
post #1054
IanCutress - Saturday, October 20, 2012 - link
Because Hyper ICs fell out of favor, motherboard manufacturers are now reluctant to spend time in optimizing the Hyper IC kits to work with their systems. Thus the kits often have to fall back onto default settings, and they sometimes do not work. As one set of ICs is phased out, and new ICs come in, the newer ICs get priority.Ian
PS. You'll find me on the overclock.net HWBot team :)
CherryBOMB - Friday, October 19, 2012 - link
I have 16gb of the fastest money could buy around that era running on x79 @ 1666 6-6-6-18-1t right now.well over $1000 invested. Each 6gb kit was over $450 - bought the extra to future proof to quad lanes today.
2x CMT6GX3M3A1600C6
1x CMT4GX3M2A1600C6
http://www.newegg.com/Product/Product.aspx?Item=N8...
http://www.newegg.com/Product/Product.aspx?Item=N8...
saturn85 - Friday, October 19, 2012 - link
how about adding a folding on cpu benchmark with different memory speed?