Customers Customers Customers

As a roadmap announcement today, the focus isn’t so much on the customers but on the technology. Because Intel is moving into a phase where it expects its IFS offerings to compete against the established players, it has to consider its disclosures with respect to both its internal use and any external interest, which is a new concept for the company – at least on this scale compared to its previous foundry efforts.

Intel CEO Pat Gelsinger, in the company’s Q3 financial call last week, was keen to point out that they already have a large hyperscaler customer signed up for their next generation packaging technology, however today there would appear to also be another customer in the mix. Now we assume that Intel’s Foundry Services is talking to 100s of chip companies, big and small, but it doesn’t take much to sign an NDA to start to talk – what will be interesting is when customers start making commitments to using Intel’s facilities, and if any of those are volume orders.

As part of the announcement today, Intel held a little bit back from us, saying that they are saving some of the details specifically for the event that is going on as we publish this piece. All we know is that our draft press release has a big yellow bar that says ‘[customer news]’ on it, right next to Intel’s 20A process node details.

For reference, Intel 20A is a 2024 technology using first generation Gate-All-Around transistors, marketed as RibbonFETs, as well as backside power delivery, marketed as PowerVias. At this time Intel expects to have second/third-generation EMIB available as well as fourth-generation Foveros Direct. So if a customer is already committing to Intel 20A, there’s going to be a lot of potential here.

When the announcement is made, we will update this news article.

To conclude, Intel maintains that these roadmaps will showcase a clear path to process performance leadership* by 2025. It’s a tall order, and the company has to execute better than it has in recent memory - but that’s kind of why the company has rehired a number of former Intel experts and fellows in research, product design, and execution.

*as measured by performance per watt at iso-power

Here's a secondary comparison chart (compared to the one on page one) with all three main foundry offerings listed in each of the main segments that Intel has discussed today.

Intel’s Next Generation Packaging: EMIB and Foveros
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  • Oxford Guy - Wednesday, August 11, 2021 - link

    ‘preposterously-named T2’

    According to mainstream news, Google’s phone-drone-bomb military program was called Skynet. Can’t these megacorps be even slightly creative?
  • mode_13h - Thursday, August 12, 2021 - link

    This is *exactly* what I meant by pulling the thread off-topic. Sometimes, it naturally meanders into these directions, but you grab the wheel and launch us directly off the path and into the weeds.

    This is not contributing in good faith, IMO. It's like you're just searching for somewhere to air your grievances, not unlike the right-wingers who try to derail the discussion into some dark place about same-sex bathrooms.

    > ‘preventative indefinite detention’ — a policy then president Obama laid out in a speech.

    If he uttered those words, it must have been in reference to Guantanamo Bay, which he actually tried to shut down (and on his very first day in office, no less)! And while that move was foiled by political opposition, he did succeed in mostly emptying it out. Obama lectured on Constitutional law at Harvard and he was an institutionalist (for better and for worse). He's not the guy to end Habeas Corpus.

    > China is working to force employees to grin correctly in order for office equipment to work.

    I thought that was Canon, which is Japanese.
  • cheshirster - Tuesday, November 23, 2021 - link

    It is no secret that having "Intel 10nm" being equivalent to "TSMC 7nm"

    There is zero evidence these are equal.
    In fact even the latest 12 gen ADL on 10+++ aka ESF loses in power efficiency to Zen3 bult on N7+12FF
  • CBeddoe - Wednesday, December 8, 2021 - link

    One of Intel's main issues is they are trying to push transistor density beyond the capability of the manufacturing process.
    They are being hyper aggressive with their designs and can't back it up with their manufacturing capability.
    What that wiki chip transistor density comparison shows is they aren't changing the aggressive nature of their designs which likely means they won't be achieving high enough yields to meet targets and they might continue to miss their manufacturing roadmaps.

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