Memory Module Technologies: TCP, EPOC and FEMMA

Kentron Technologies, another pioneer in memory solutions and best known for their Quad Band Memory, have also tried their hand in creating something that resolves the size issue.

The result is quite different to what Kingston and Elpida came up with. The Foldable Electronic Memory Module Assembly (FEMMA) technology involves two separate PCBs, connected via a flexible circuit tape component.
 

A half-open FEMMA Module

A closed FEMMA module from above

Kentron's FEMMA platform again targets thermal dissipation, reliablility and density. It is scalable to future chip technologies such as BGA (Ball Grid Array) and Flash. Kentron also says FEMMA is by nature a much lower cost alternative to the chip stacking method also used for high-density platforms. FEMMA eliminates the high cost of stacking chips, the yield "fall-out" of stacking and the significant time delay of the stacking process.

Along with standard Desktop DIMMs, FEMMA is also available in the SO-DIMM format.