Memory Module Technologies: TCP, EPOC and FEMMAby Andy Hui on August 26, 2002 8:58 AM EST
- Posted in
A number of RAM manufacturers are taking an active role in resolving this issue, resulting in recent developments that advance memory module technology. Using a little bit of clever thinking, Elpida and Kingston have come up with a way to avoid the huge DIMMs by going 3D: mount two memory devices over each other on a standard height DIMM.
While the idea of stacking two TSOPs (Thin Small Outline Packages) has been floating around for a few years, Elpida and Kingston have only recently come up with new methods improving on this design.
Kentrontech, another RAM manufacturer, decided to take a slightly different approach, and use two PCBs side by side.