Noise Testing ATX, BTX

Besides the thermal advantages Intel claims BTX to have over ATX, Intel also states that BTX systems will produce much lower sound levels then ATX systems. We can see this as being true since our BTX evaluation kit includes the AOpen B300 which has zero case fans. The only cooling equipment in this BTX system is the thermal module which adjusts its speed according to the overall temperature of the system and the power supply. In turn, the only hardware producing any sound in the system would be the thermal module and the power supply.

As we measured the sound levels of the AOpen B300, we noticed that as the Pentium 550's temperature rose from 62 to 63 degrees, the fan speed increased from 1400rpm to 1700 rpm. We realized that the heat sink fan was overcompensating for the increase of 1 degree to bring the temperature back down to a stable level.

Sound Benchmarks

We see that the uBTX AOpen B300 combined with Intel's thermal module and FSP power supply produced an extremely quiet 41dB of sound compared to the ATX D.Vine 5 and uATX TT-501. The D.Vine 5 had dual 60mm fans at the back while the TT-501 actually had two 80mm fans at its rear that produced the extra 9-10dB along with the CPU heatsink fans and power supplies.

The low sound levels of the BTX system came at a price of slightly higher temperatures through the case. Is the point of BTX to eliminate case fans entirely or just reduce them to keep a positive balance between thermal and sound levels? If a 80mm or even a 60mm fan is placed at the back of the chassis directly in line with the CPU thermal module, the air flow will be increased having a greater cooling effect on the components while still keeping sound levels to a minimum.

Thermals: MicroBTX Impact of BTX, Launch Schedule
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  • DerekBaker - Monday, November 15, 2004 - link

    #25

    From here I should think: ">From the picture we see the flow of warm air pulled forward from beyond the VGA card. As it moves towards the front of the case the air flows over the Southbridge and Northbridge passively cooling each chip. We then see from the shades of red the air warms up as it flows through the CPU heatsink then begins to cool as it moves out the front of the case."

    http://www.anandtech.com/casecooling/showdoc.aspx?...


    Derek
  • Oxonium - Monday, November 15, 2004 - link

    Let's see, a new form factor with new case requirements and STILL no standardized connector for the front Power/Reset/LED's/etc.? I'm all for cooler cases, but a standardized connector for those items is something that should have been implemented years ago.
  • HardwareD00d - Monday, November 15, 2004 - link

    #24, who cares since athlons run much cooler and don't need this case form factor.
  • Doormat - Monday, November 15, 2004 - link

    I heard a rumor that it wont work with Athlon 64 chips or any type of chip that has the memory controller integrated with the processor, because the distance between the processor and the RAM banks are too far. Anyone confirm this?
  • Superbike - Monday, November 15, 2004 - link

    Wow AT is back.
  • phisrow - Monday, November 15, 2004 - link

    While I agree that the tweaky enthusiast market doesn't have much to gain at the moment by moving from ATX to BTX, especially as most of them are running A64s or praying-for-death overclocked mobile Athlons, I think there is certainly something to be said for the form-factor. It does seem to be more efficient for cooling than your average ATX(especially for small cases). Even if you are running some PentiumM or a derivative thereof, more efficient is still better. After all, if a given case design can cool a high-end Prescott without deafening its user, it can probably cool a brutally overclocked Pentium M with its fans running at half the speed. For that matter, if the trace length issues aren't actually crippling, I would like to see some A64 motherboards in this format.
  • johnsonx - Monday, November 15, 2004 - link

    Visualize an office full of MicroBTX Desktop computers. Visualize the women in the office cupping their hands around the heat exhaust... visualize the overclocking tips flowing around the female staff as they strive to increase heat output... visualize the men pouring sweat, desparately trying to duct-tape the front vent to block the hot Intel Air.

    I'm sorry, but any spec that seeks to exhaust hot air out the FRONT of any case, whether it be a desktop, tower or SFF, is just plain STUPID.

  • araczynski - Monday, November 15, 2004 - link

    my god, after all these years, they fall back on the packard bell mentality...
  • KristopherKubicki - Monday, November 15, 2004 - link

    GTMan: Temperatures were certainly taken with the cases closed.

    Kristopher
  • GTMan - Monday, November 15, 2004 - link

    I wonder if all those temperature measurements were done with the case open? I would think a case designed for efficient air flow would only perform properly (as designed) when fully assembled!!!

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