Demonstrating Sunny Cove and Gen11 Graphics

As part of the Architecture Event, Intel ran a number of demos on a chip that was supposedly based on the new Sunny Cove cores and Gen11 graphics.

These were development systems with these funky looking heatsinks and loud fans to ensure there was no thermal throttling. One thing worth noticing is that black bit of tape on the heatsink here, which wasn’t present on one of the other demo units.

Hello Ice Lake-U. Being a U-series heatsink, this means that the Core is likely designed for a 15W scenario.

Perhaps it’s no surprise that Intel wasn’t giving anything away in terms of the exact core count on display, speeds, feeds, and power. The demos that were present involved 7-Zip and gaming.

The 7-Zip demo was relatively straight forward, showing how the new instructions such as Vector-AES and SHA-NI in Sunny Cove can give the processor a 75% boost in performance over an equivalent Skylake based platform at iso-frequency. This falls under the ‘specialist’ improvements to the core rather than the general purpose improvements.

The other demo was Tekken 7, being run on a Sunny Cove + Gen11 machine and compared to a Skylake + Gen9 implementation. It looked a good deal smoother that’s for sure, however it was clear that it had some way to go to be fully out of the 30 FPS minimums.

The Next Generation Gen11 Graphics: Playable Games and Adaptive Sync! Going Beyond Gen11: Announcing the XE Discrete Graphics Brand
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  • f1nalpr1m3 - Wednesday, December 12, 2018 - link

    Yeah, they totally put it together in three weeks and everything.

    Get a clue.
  • pkgtech - Thursday, December 20, 2018 - link

    For years Sohail Ahmed was the roadblock to Intel doing any creative package technology by blocking silicon support. He finally was shown for what he was after 2+ year process technology delays and re-invented this. Good riddance Sohail
  • Adonisds - Wednesday, December 12, 2018 - link

    How do the Intel process delays influence their microarchitecture plans? 10 nm was already supposed to be here and with it its new microarchitecture, Ice Lake. Does the Ice Lake design continue to get improved as the delays kept happening or was it finalized years ago? Why? What about the microarchutectures succeeding Ice Lake?
  • III-V - Wednesday, December 12, 2018 - link

    This is Ice Lake. Might be a 14nm port (unclear at this point why the name change), but it's at the very least a close relative.
  • III-V - Wednesday, December 12, 2018 - link

    Actually, given the name on the heat sink, it is probably just straight up Ice Lake
  • HStewart - Thursday, December 13, 2018 - link

    I believe the road map states Ice Lake will be on 10nm. More importantly it will be on Sunny Cove which is significant update to Architexture.
  • AdhesiveTeflon - Wednesday, December 12, 2018 - link

    Intel and their naming scheme....they should call one "blue slushie lake"
  • prisonerX - Wednesday, December 12, 2018 - link

    Plans? Intel are in full scale panic mode right now. I'm sure they have new plans every week.
  • jjj - Wednesday, December 12, 2018 - link

    LOL you went in full fanboy mode with the 144mm package being small.
    The package is that size for PoP, the die is much much smaller, they can fit way more 10nm cores than that in such a large area, even without a base die.
    Anyway, there are no relevant details on Foveros and that's problematic. The first question is cost, then you would want to know details about pitch and so on. Intel is by no means the first to announce such a solution so the details are what matters.
    This is how you get to a 3D monolithic die in some years so any foundry that wants to stay in the most advanced node game, needs to push the packaging roadmap.
  • Ian Cutress - Wednesday, December 12, 2018 - link

    I specifically said the package was small, and the die was smaller than the package.

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