Looking To The Future: NAND Flash Scales Up to 64 TB SSDs in 2030

Over the past few years, the NAND Flash industry has gone through two major shifts in technology: the movement from 1 to 2 to 3 bits per cell, which directly increases bit density and capacity, and also moving from planar flash to variants of 3D stacking. Stacking can refer to individual NAND dies, as well as stacking those dies into a single package: both of these features are being extensively investigated to increase density also. There are two main drivers for this: reduction in cost, and capacity. However, despite this, the predictions in the ITRS report for NAND flash are primarily looking at improvements to numbers of layers rather than lithography changes or moving to more bits per cell.

As we can see, TLC (according to the report) is here to stay. QLC, or whatever you want to call it, is not mentioned. The two changes are the number of memory layers, moving from 32 today to 128 around 2022 and then 256/512 by 2030, and the number of word-lines in one 3D NAND string. This gives a product density projection of 256 Gbit packages today to 1 Tbit packages in 2022 and 4 Tbit packages in 2030.

If we apply this to consumer drives available today, we can extrapolate potential SSD sizes for the future. The current Samsung 850 EVO 4 TB uses Samsung’s 48-layer third generation V-NAND to provide 256 Gbit TLC parts. Alongside the 4 TB of memory, the controller requires 4 GB of DRAM, which is another concern to remember. So despite the report stating 256 Gbit in 32-layer, we have 256 Gbit in 48-layer, which is a difference primarily in die-size predictions for the report. Still, if we go off of the product density we should see 12 TB SSDs by 2020, 16 TB in 2022, 48 TB in 2028 and 64 TB drives in 2030. It’s worth noting that the ITRS report doesn’t mention power consumption in this table, nor controller developments which may be a substantial source of performance and/or capacity implementations.

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  • pixelstuff - Wednesday, July 27, 2016 - link

    I think Core2 essentially accelerated the market saturation we are seeing and causing the PC market to decline a bit. My Core2 E8400 still runs Window 10 relatively fine, although I have built two more since because I like being near the cutting edge. However I know quite a few people still using Core2 CPUs for their basic computing needs.

    There just haven't been any new apps that are more resource intensive than a word processor or web browser which the entire world needs. So the PC replacement market has stagnated a bit.
  • stardude82 - Wednesday, July 27, 2016 - link

    Most Core processors are faster than the ho-hum Cherry Trail offerings you find low end PCs. So buying a new cute shiny black little box to replace your beige big box doesn't guarantee much.
  • boeush - Wednesday, July 27, 2016 - link

    It reads a little weird/myopic that only certain technologies are being considered while forecasting all the way out to 2030. For instance, lots of NAND/DRAM discussion but no mention of upcoming or already early-adoption tech like 3D XPoint or memristors, etc. No mention of optoelectronics (like photonic signalling on- and off-chip), no mention of III-V and other 'exotic' materials for chip manufacturing and improved frequency/power scaling (with focus instead devoted to feature sizes/stacking/platter size/defects.) And so on.

    I mean, if you're forecasting 5 years ahead, I'd understand. But talking about 15 years into the future but only extrapolating from what's on the market right now -- as opposed to what's in the labs and on drawing boards -- seems to be a little too pessimistic and/or myopic.
  • Ian Cutress - Wednesday, July 27, 2016 - link

    The full report mentions III-V and SiGe in the remit of future technologies. Anton and I are starting to discuss what parts we can pull out for individual news stories, to stay tuned.
  • Sam Snead - Wednesday, July 27, 2016 - link

    Heck I still have my Nexgen P110 cpu computer set up and run it once in awhile. From 1996. Remember the VESA local bus video card? Nexgen was later bought by AMD.
  • stardude82 - Wednesday, July 27, 2016 - link

    Ah, I remember Socket 7...
  • CoreLogicCom - Wednesday, July 27, 2016 - link

    I've still got a Dell E1705 laptop that I bought in 2006 which came with a Core Duo, which I upgraded to Core 2 Duo about 4 years into it, and maxed the RAM to 4GB (from the 2GB max it came with). It was decent, but really came alive when I put an SSD into it. I still use this laptop for basic stuff, and even some gaming (WoW and SWToR) with the Geforce Go GPU. It's definitely long in the tooth now, now running Windows 7 (it came with WinXP, but 10 is unsupported on the GPU even though there's a work around). I'm thinking mobile Kaby Lake and mobile Pascal will be the next laptop I keep for another 10 years.
  • Nacho - Wednesday, July 27, 2016 - link

    Can you beat me?
    Last month I finally upgraded my primary rig from a C2D E4300 @2.7Ghz! Memory started failing last year & I couldn't find cheap DDR2, so I was down to 2GB.
    Went for a i5 6500 and 16GB DDR4. The difference is incredible!
  • Filiprino - Wednesday, July 27, 2016 - link

    So much time since reading Anand's article on Conroe.
  • 3ogdy - Wednesday, July 27, 2016 - link

    Great article, Ian! I've found it a very good read and it's always nice to take a look back and analyze what we've been through so far.
    I also wanna point out just a few mini-errors I've found in the article:
    The Core 2 processors all came from a 143mm2 die, compared TO the 162mm2 of Pentium D. /
    by comparison to the large die sizes we see IN 2016 for things like the P100 /
    whereas the popular Core 2 Duo E6400 at $224 WAS at the same price as the Core i5-6600.
    As we NOW know, on-die IMCs are the big thing.
    Geometrical Scaling when this could NO longer operate
    By 2020-25 device features will be REDUCED (?)
    On the later -> LATTER?

    Keep up the amazing work!

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