This week at ISSCC (International Solid State Circuits Conference), Microsoft presented a talk titled ‘Xbox Series X SoC: A Next Generation Gaming Console’, with hardware engineer Paul Paternoster presenting. The 30 minute presentation covered a lot about Microsoft’s latest console processor, most of which was a repeat about what we saw at Hot Chips in August last year, however there was a new element in this presentation talking about how the console design team balanced acoustics, power, thermal performance, and processor yield, discussing where the hotspots in the design originate and where the performance/power targets of the final silicon were optimized.
Five years ago we dissected the original Xbox 360. Today we're back with the new, slim Xbox 360 and have put together a similar guide to disassembling the console...109 by Anand Lal Shimpi on 6/18/2010
Today UPS dropped off my Xbox 360 Slim (codename Valhalla) and I did exactly what you'd expect me to: run power numbers on it and take the whole thing...27 by Anand Lal Shimpi on 6/17/2010