Memory
SK hynix and TSMC announced early on Friday that they had signed a memorandum of understanding to collaborate on developing the next-generation HBM4 memory and advanced packaging technology. The initiative is designed to speed up the adoption of HBM4 memory and solidify SK hynix's and TSMC's leading positions in high-bandwidth memory and advanced processor applications. The primary focus of SK hynix's and TSMC's initial efforts will be to enhance the performance of the HBM4 stack's base die, which (if we put it very simply) acts like an ultra-wide interface between memory devices and host processors. With HBM4, SK hynix plans to use one of TSMC's advanced logic process technologies to build base dies to pack additional features and I/O pins within the confines of existing...
ASUS Z390 Platforms Now Support 128 GB of Memory
ASUS has released a new UEFI BIOS version for its ROG Maximus XI Hero motherboard that enables support of up to 128 GB of DDR4 memory platform using 32...
8 by Anton Shilov on 1/22/2019
CES 2019: GIGABYTE Aorus RGB Memory Hits DDR4-4000 with SK Hynix ICs
GIGABYTE last year entered the memory market with its Aorus RGB and GIGABYTE-branded DIMMs, designed for enthusiasts. To some degree the project was experimental with conservative DDR4-2666 and DDR4-3200...
3 by Anton Shilov on 1/14/2019
CES 2019: ADATA Spectrix Memory & SSDs Get More RGB
RGB lighting has become a major selling point for hardware aimed at gamers and performance enthusiasts. After all, since modern CPUs, GPUs, DRAMs, SSDs, and other components offer plenty...
4 by Anton Shilov on 1/14/2019
CES 2019: TeamGroup And ASRock Release Phantom Gaming Branded Memory and SSD
One of the leading players in memory Team Group has joined forces with ASRock to release the Phantom Gaming branded T-FORCE DELTA Phantom Gaming RGB SSD and T-FORCE XCALIBUR...
5 by Gavin Bonshor on 1/10/2019
CES 2019: Thermaltake Unveils Its WaterRAM RGB Liquid Cooled DDR4-3200 Memory
At CES 2019 Thermaltake officially entered the memory market with two new kits of DDR4 3200 RAM which not only include integrated water blocks but also includes 16.8 million...
13 by Gavin Bonshor on 1/9/2019
JEDEC Updates HBM Spec to Boost Capacity & Performance: 24 GB, 307 GB/s Per Stack
JEDEC this week published an updated version of its JESD235 specification, which describes HBM and HBM2 DRAM. The new version of the standard allows memory manufacturers to increase capacities...
15 by Anton Shilov on 12/19/2018
Intel's Architecture Day 2018: The Future of Core, Intel GPUs, 10nm, and Hybrid x86
It has been hard to miss the fact that Intel has been vacuuming up a lot of industry talent, which brings with them a lot of experience. Renduchintala, Koduri...
149 by Dr. Ian Cutress on 12/12/2018
Apacer Launches 32-Bit SODIMM for Arm & RISC-V Systems
Apacer has announced a lineup of 32-bit SO-DIMMs designed for systems based on processors featuring Arm, RISC, or RISC-V architectures. The memory modules will enable SoC developers to take...
5 by Anton Shilov on 11/26/2018
Cadence Tapes Out GDDR6 IP on Samsung 7LPP Using EUV
Cadence has announced that it has successfully taped out its GDDR6 IP on Samsung’s 7LPP fabrication process. The new building blocks should enable developers of various chips to be...
11 by Anton Shilov on 11/26/2018
Your Highness: G.Skill Trident Z Royal, Bling Factor 11
G.Skill this week has officially introduced its Trident Z Royal family of memory modules. This memory featuring crystalline light bars with RGB lighting and polished heat spreaders. The modules...
4 by Anton Shilov on 11/20/2018
SK Hynix Reveals DDR4-3200 Memory Chips with 4 Phase Clocking
SK Hynix this week announced that it has completed development of its latest-generation DDR4 memory chips. The new DRAM chips are made using the company’s second-generation 10 nm-class fabrication...
4 by Anton Shilov on 11/16/2018
SK Hynix Develops First 16 Gb DDR5-5200 Memory Chip, Demos DDR5 RDIMM
SK Hynix on Thursday announced that it had completed development of its first DDR5 memory chip. The new chip offers a capacity of 16 Gb and is said to...
29 by Anton Shilov on 11/15/2018
G.Skill Unveils 64 GB DDR4-4266 and 128 GB DDR4-4000 Kits for HEDTs
Coinciding with today’s launch of Intel’s HEDT “Skylake-X/Basin Falls Refresh” family of CPUs, G.Skill today announced its new 64 GB DDR4-4266 and 128 GB DDR4-4000 kits designed for high-end...
1 by Anton Shilov on 11/13/2018
In The Lab: Double Capacity 2x32GB DDR4 from G.Skill and ZADAK
One of the interesting things to come out of the news in recent weeks is the march to double capacity memory. In today’s market, memory modules for consumer grade...
19 by Ian Cutress on 11/9/2018
SK Hynix Launches 96-Layer 3D NAND and Discloses QLC Plans
SK Hynix this week officially launched its new 96-layer 3D NAND flash memory chips, which feature a new architecture and a faster interface. The NAND has already been qualified...
4 by Anton Shilov on 11/8/2018
Micron Kicks Off Mass Production of 12 Gb LPDDR4X DRAM Chips
Micron this week announced that it had started mass production of its first LPDDR4X memory devices using its second-generation 10 nm-class process technology. The new memory devices offer standard...
10 by Anton Shilov on 11/8/2018
U.S. Government Indicts Chinese DRAM Maker JHICC on Industrial Espionage; Bans Exports To Firm
The U.S. Department of Commerce this week banned U.S. exports to a China-based maker of DRAM. The DoC believes that Fujian Jinhua Integrated Circuit Company (also known as Fujian...
58 by Anton Shilov on 11/1/2018
Silicon Power Enters Market of Enthusiast-Class DRAM with DDR4-4133
Silicon Power currently offers a broad range of products that span from memory cards to SSDs and from power banks to headphones. For several years the company has been...
9 by Anton Shilov on 10/23/2018
Intel's Response: Micron’s Control of 3D XPoint Fab Will Not Disrupt Optane Roadmap
Intel late on Friday said that Micron’s intention to gain full control of the IMFT joint venture will not interrupt its plans concerning products based on 3D XPoint memory...
26 by Anton Shilov on 10/22/2018
Samsung Shows Off 256 GB DDR4 RDIMM: Coming to Servers Soon
Samsung this week demonstrated its first 256 GB memory module for upcoming servers. The new Registered DIMM (RDIMM) is based on Samsung’s 16 Gb DDR4 memory devices introduced earlier...
18 by Anton Shilov on 10/19/2018
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