CPUs
SK hynix and TSMC announced early on Friday that they had signed a memorandum of understanding to collaborate on developing the next-generation HBM4 memory and advanced packaging technology. The initiative is designed to speed up the adoption of HBM4 memory and solidify SK hynix's and TSMC's leading positions in high-bandwidth memory and advanced processor applications. The primary focus of SK hynix's and TSMC's initial efforts will be to enhance the performance of the HBM4 stack's base die, which (if we put it very simply) acts like an ultra-wide interface between memory devices and host processors. With HBM4, SK hynix plans to use one of TSMC's advanced logic process technologies to build base dies to pack additional features and I/O pins within the confines of existing...
SuperComputing 15: Intel’s Knights Landing / Xeon Phi Silicon on Display
There are lots of stories to tell from the SuperComputing 15 conference here in Austin, but a clear overriding theme – in order to reach ‘Exascale’ (the fancy name...
26 by Ian Cutress on 11/19/2015
The AMD A8-7670K APU Review: Aiming for Rocket League
Over the past couple of years, AMD has slowly released their mainstream brand of Kaveri processors. In turn, we have reviewed them, and they consistently aim to provide a...
154 by Ian Cutress on 11/18/2015
A Few Notes on Intel’s Knights Landing and MCDRAM Modes from SC15
When learning about new hardware, there are always different angles to look at it. For the most part, manufacturers talking to the media will focus on the hardware aspects...
10 by Ian Cutress on 11/16/2015
Intel @ SC15: Launching Xeon Phi “Knights Landing” & Omni-Path Architecture
The fourth and final of the major SC15 conference announcements/briefings for today comes Intel. As Intel is in the middle of executing on their previously announced roadmap, they aren’t...
7 by Ryan Smith on 11/16/2015
IBM & Xilinx @ SC15: Collaborating For Better POWER/FPGA System Integration
Kicking off this week is the annual International Conference for High Performance Computing, Networking, Storage, and Analysis, better known as SC. Along with the International Supercomputing Conference (ISC), SC...
7 by Ryan Smith on 11/16/2015
ARM Announces New Cortex-A35 CPU - Ultra-High Efficiency For Wearables & More
Today as part of the volley of announcements at ARM's TechCon conference we discover ARM's new low-power application-tier CPU architecture, the Cortex-A35. ARM follows an interesting product model: The...
25 by Andrei Frumusanu on 11/10/2015
ARM Announces ARMv8-M Instruction Set For Microcontrollers – TrustZone Comes to Cortex-M
Kicking off today in Santa Clara, California is ARM’s annual developer conference and expo, TechCon. Although ARM announces products year-round, they always have a couple of announcements reserved for...
10 by Ryan Smith on 11/10/2015
Examining Intel's New Speed Shift Tech on Skylake: More Responsive Processors
Modern computer processors are constantly changing their operating frequency (and voltage) depending on workload. For Intel processors, this is often handled by the operating system which will request a...
54 by Brett Howse on 11/6/2015
The IBM POWER8 Review: Challenging the Intel Xeon
We recently got our hands on a S822L, an dual socket OpenPOWER server. IBM claims that this is an affordable, high performance and highly expandable alternative to the typical...
146 by Johan De Gelas on 11/6/2015
GlobalFoundries and AMD Announce First 14nm FinFET Sample Production Success
GlobalFoundries, AMD’s former chip manufacturing arm, is a fab that has seen some hard times. After being spun-off from AMD in 2009, the company has encountered repeated trouble releasing...
58 by Ryan Smith on 11/5/2015
AMD Launches Excavator Based R-Series APUs for Embedded with DDR4 Support
Despite the recent news surrounding AMDs reorganization and financials, today AMD is announcing the launch of its first DDR4 processors. But rather than aiming at the high end or...
34 by Ian Cutress on 10/21/2015
Intel Launches ‘Greenlow’: C236 Chipset and Skylake E3-1200 v5 Xeons
One of the recent notable aspects about the Xeon E3 family was the lack of a significant presence with Intel’s Broadwell architecture. A handful of them were released under...
31 by Ian Cutress on 10/19/2015
AMD Announces FY 2015 Q3 Results: Decreased Computing And Graphics Sales Hurt Bottom Line
Today AMD has announced their third quarter earnings for fiscal year 2015. AMD saw a 13% increase in revenue over Q2 2015, but revenues were down almost 26% over...
78 by Brett Howse on 10/15/2015
AMD To Spin-Off Back-End Testing & Assembly Operations Into Joint Venture For $371 Million
AMD’s Q3 2015 earnings release just hit the wire a bit ago, and while we’re still working on putting together that story we wanted to immediately jump into what...
41 by Ryan Smith on 10/15/2015
Intel Announces FY 2015 Q3 Results: Strong Earnings Despite Client Computing Drop
Intel released their third quarter earnings for fiscal year 2015 today, and it was certainly a rocky quarter. Their revenue for the quarter was $14.5 billion, which was in-line...
23 by Brett Howse on 10/13/2015
AMD Corporate Fellow Phil Rogers Leaves Company, Joins NVIDIA
With respect to both structure and personnel, the last few months have been busy – if not tumultuous – for AMD. The company recently reorganized itself so that their...
83 by Ryan Smith on 10/13/2015
HSA Foundation Update: More HSA Hardware Coming Soon
When AMD set about bringing their CPU/GPU fusion initiative to life with the Heterogeneous System Architecture (HSA) earlier this decade, one point AMD made early-on was that while they...
20 by Ryan Smith on 10/6/2015
Software Guard Extensions on Specific Skylake CPUs Only
Through the staggered release of Intel’s 6th Generation Core processors, known as Skylake, we reported in our architecture deep dive that Intel would be introducing a raft of known...
19 by Ian Cutress on 10/5/2015
AMD Releases New PRO Mobile APUs: Carrizo up to A12-8800B
We touched upon this very briefly in our recent HP Elitebook news, but at the end of September AMD officially launched four new professional mobile APUs under the AMD...
53 by Ian Cutress on 10/2/2015
Apple’s A9 SoC Is Dual Sourced From Samsung & TSMC
Picking up from our conversation this morning on Apple’s A9 SoC, the crew over at Chipworks has been working hard over the weekend to decap A9 and their first...
99 by Ryan Smith on 9/28/2015
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