16 Gb

Samsung this week demonstrated its first 256 GB memory module for upcoming servers. The new Registered DIMM (RDIMM) is based on Samsung’s 16 Gb DDR4 memory devices introduced earlier this year and takes advantage of the company’s 3DS (three-dimensional stacking) packaging. The new module will offer higher performance and lower power consumption than two 128 GB LRDIMMs used today. Samsung’s 256 GB DDR4 Registered DIMM with ECC carries 36 memory packages featuring 8 GB (64 Gbit) of capacity each, along with IDT’s 4RCD0229K register chip (to buffer address and command signals and increase the number of ranks supported by a memory channel). The packages are based on four single-die 16 Gb components that are interconnected using through-silicon vias (TSVs). Architecturally, the 256 GB module is...

Samsung Adds 32 GB UDIMMs to Memory Lineup

Samsung has quietly added 32 GB unbuffered DDR4 memory modules to its lineup of products. The UDIMMs are based on the company’s 16 Gb chips, which were introduced earlier...

19 by Anton Shilov on 9/5/2018

Samsung Unveils 32 GB DDR4-2666 SO-DIMMs

Samsung on Wednesday introduced its first consumer products based on its 16 Gb DDR4 memory chips demonstrated earlier this year. The new SO-DIMMs are aimed at high-performance notebooks that...

19 by Anton Shilov on 5/30/2018

Samsung Demos 64 GB RDIMM Based on 16 Gb Chips, Promises 256 GB LRDIMMs

Samsung is demonstrating its 64 GB DDR4 memory module based on 16 Gb chips this week at the OCP U.S. Summit. The 64 GB RDIMM that the company is...

11 by Anton Shilov on 3/22/2018

SK Hynix’s Product Catalog Lists 16 Gb DDR4 Chips, Opens Doors to 256 GB DIMMs

SK Hynix has recently added single-die DDR4 memory chips featuring 16 Gb capacity to its product catalog. The benefit of the increase in single-die capacity is two fold: not...

14 by Anton Shilov on 1/25/2018

SK Hynix Updates Lineup: 8 GB LPDDR4 DRAM Packages for Mobile Devices

SK Hynix has quietly added its new 8 GB LPDDR4 package to the family of mobile DRAM offerings. The new package paves the way for single-package smartphones and tablets...

8 by Anton Shilov on 12/20/2016

Samsung Introduces 8 GB LPDDR4-4266 Package for Mobile Devices

Samsung this week announced its first LPDDR4 memory chips made using its 10nm-class DRAM fabrication technology. The new DRAM ICs feature the industry’s highest density of 16 Gb, are...

40 by Anton Shilov on 10/21/2016

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