Earlier this year Intel enabled support of high-capacity 32 GB memory modules based on 16 Gb memory chips on select client platforms for enthusiasts and prosumers, but until recently 32 GB unbuffered DIMMs were only available from Samsung. This is going to change soon as a leading supplier of memory modules for enthusiasts prepping their 32 GB UDIMMs that are demonstrated at Computex. To build 32 GB UDIMMs, module producers need 16 Gb ICs. These DRAMs are produced using the most advanced process technologies possible: 2nd/3rd Gen 10nm-class. Up until recently such chips were only available from Samsung and the latter primarily used them to build high-end RDIMMs for servers or SO-DIMMs for laptops and mobile workstations. But now Micron is starting to ramp up...
In a rather unexpected turn of events, Crucial has unveiled its first 32 GB DDR4 UDIMMs, which are based on Micron's yet-to-be-announced 16 Gb memory chips. The DIMMs will...10 by Anton Shilov on 6/3/2019
Samsung this week demonstrated its first 256 GB memory module for upcoming servers. The new Registered DIMM (RDIMM) is based on Samsung’s 16 Gb DDR4 memory devices introduced earlier...18 by Anton Shilov on 10/19/2018
Samsung is demonstrating its 64 GB DDR4 memory module based on 16 Gb chips this week at the OCP U.S. Summit. The 64 GB RDIMM that the company is...11 by Anton Shilov on 3/22/2018
SK Hynix has recently added single-die DDR4 memory chips featuring 16 Gb capacity to its product catalog. The benefit of the increase in single-die capacity is two fold: not...14 by Anton Shilov on 1/25/2018
SK Hynix has quietly added its new 8 GB LPDDR4 package to the family of mobile DRAM offerings. The new package paves the way for single-package smartphones and tablets...8 by Anton Shilov on 12/20/2016
Samsung this week announced its first LPDDR4 memory chips made using its 10nm-class DRAM fabrication technology. The new DRAM ICs feature the industry’s highest density of 16 Gb, are...40 by Anton Shilov on 10/21/2016