Samsung this week demonstrated its first 256 GB memory module for upcoming servers. The new Registered DIMM (RDIMM) is based on Samsung’s 16 Gb DDR4 memory devices introduced earlier this year and takes advantage of the company’s 3DS (three-dimensional stacking) packaging. The new module will offer higher performance and lower power consumption than two 128 GB LRDIMMs used today. Samsung’s 256 GB DDR4 Registered DIMM with ECC carries 36 memory packages featuring 8 GB (64 Gbit) of capacity each, along with IDT’s 4RCD0229K register chip (to buffer address and command signals and increase the number of ranks supported by a memory channel). The packages are based on four single-die 16 Gb components that are interconnected using through-silicon vias (TSVs). Architecturally, the 256 GB module is...
Samsung is demonstrating its 64 GB DDR4 memory module based on 16 Gb chips this week at the OCP U.S. Summit. The 64 GB RDIMM that the company is...11 by Anton Shilov on 3/22/2018
SK Hynix has recently added single-die DDR4 memory chips featuring 16 Gb capacity to its product catalog. The benefit of the increase in single-die capacity is two fold: not...14 by Anton Shilov on 1/25/2018
SK Hynix has quietly added its new 8 GB LPDDR4 package to the family of mobile DRAM offerings. The new package paves the way for single-package smartphones and tablets...8 by Anton Shilov on 12/20/2016
Samsung this week announced its first LPDDR4 memory chips made using its 10nm-class DRAM fabrication technology. The new DRAM ICs feature the industry’s highest density of 16 Gb, are...40 by Anton Shilov on 10/21/2016