Razer Files for IPO in Hong Kong to Raise $600 Million
This week Razer has made a preliminary filing for IPO on the Hong Kong Stock Exchange. The company plans to raise $600 million for future growth, particularly in Asia...
24 by on 7/8/2017
AOC Teams Up with Porsche Design for PDS241 and PDS271 Displays
AOC this week introduced two new displays that it co-developed with the Austrian arm of the Porsche Design Group. The PDS241 and PDS271 feature IPS panels with FHD resolution...
20 by on 7/8/2017
Qualcomm’s New Lawsuit Cites Six Patents, Seeks US Sales Ban of Infringing Apple Products
Qualcomm is about to enter another round of its legal battle against Apple. With a new complaint, the company is set to file on Friday with the U.S. ITC...
64 by on 7/6/2017
Nokia Smartphones to Exclusively Use Zeiss Optics
HMD Global and Zeiss on Thursday announced that they had signed an agreement under which upcoming Nokia-branded smartphones will use Zeiss-branded optics exclusively. The companies said that they would...
34 by on 7/6/2017
EKWB Launches Aftermarket EK-M.2 Aluminum Heatsink for M.2 SSDs
EKWB (EK Water Blocks) on Wednesday introduced a useful but slightly different to their normal routine type of product. The company has started to sell its EK-M.2 NVMe passive...
25 by on 7/6/2017
Samsung’s Multi-Billion Fab in Pyeongtaek Starts Production of 64-Layer V-NAND
Samsung on Tuesday announced that it had started mass production of 64-layer V-NAND memory in its newly build fab in Pyeongtaek, South Korea, and the first batch had already...
17 by on 7/6/2017
Toshiba's 768Gb 3D QLC NAND Flash Memory: Matching TLC at 1000 P/E Cycles?
Toshiba last week announced its first 3D NAND flash memory chips featuring QLC (quadruple level cell) BiCS architecture. The new components feature 64 layers and developers of SSDs and...
37 by on 7/3/2017
Nokia 6 to Hit U.S. Market on July 10: 5.5-inch LCD, Snapdragon 430, $229
HMD Global has announced that it would begin sales of its Nokia 6 smartphone in the U.S. in early July. The product will be available in two colors and...
27 by on 7/3/2017
GIGABYTE Joins AM4 Mini-ITX Club with GA-AB350N-Gaming Wi-Fi Motherboard
GIGABYTE has announced its first Mini-ITX motherboard for AMD’s AM4 processors. The GA-AB350N-Gaming WIFI (or simply AB350N-Gaming) Mini-ITX is based on AMD’s ‘performance-class’ B350 chipset and provides modern features...
23 by on 7/3/2017
ASUS Launches XG-C100C 10 GBase-T Adapter: Aquantia AQC107, $99
ASUS this week released the first inexpensive vendor-based consumer-grade 10 GbE / 10GBase-T card powered by an Aquantia silicon. The card can be installed in any modern PC with...
26 by on 7/3/2017
LG’s 34UC89G 21:9 Curved Display with G-Sync, 144 to 166 Hz, Available for $999
LG has begun to sell its new ultra-wide curved display that appears to be its first monitor to support NVIDIA’s G-Sync technology. The LG 34UC89G resembles the 34UC79G display...
21 by on 7/3/2017
G.Skill Announces Quad-Channel DDR4-4200 Kit for Intel Skylake-X CPUs
G.Skill this past week has formally announced its quad-channel memory kits designed for the latest Intel Core i7 (Skylake-X) CPUs and the Intel X299 platform. The flagship 64 GB...
11 by on 6/29/2017
Western Digital Launches New My Passport Ultra HDDs: New Enclosure, Up to 4 TB
Western Digital this week refreshed its My Passport Ultra lineup of small form-factor external HDDs. The new hard drives use a new enclosure and come with software that backs...
26 by on 6/29/2017
AMD Launches Ryzen PRO CPUs: Enhanced Security, Longer Warranty, Better Quality
This morning AMD is introducing their Ryzen PRO processors for business and commercial desktop PCs. The new lineup of CPUs includes the Ryzen 3 PRO, Ryzen 5 PRO and...
77 by on 6/29/2017
Micron Discontinues Lexar Business, Plans to Focus on Higher-Margin Products
Micron this week announced plans to discontinue its Lexar removable media storage business as a part of the company’s strategy to shift to higher margin NAND flash-based products. The...
18 by on 6/28/2017
Western Digital Announce BiCS4 3D NAND: 96 Layers, TLC & QLC, Up to 1 Tb per Chip
Western Digital on Tuesday formally announced its fourth-generation 3D NAND memory, developed as part of the Western Digital/Toshiba joint venture. The fourth-generation BiCS NAND flash chips from Western Digital...
22 by on 6/28/2017
Memblaze Launches PBlaze5 SSDs: Enterprise 3D TLC, Up to 6 GB/s, 1M IOPS, 11 TB
Memblaze has introduced its new generation of server-class NVMe SSDs for mixed and mission critical workloads. The PBlaze5 SSDs are based around Micron's 3D eTLC memory and paired with...
19 by on 6/24/2017
Samsung Begins Production of Exynos i T200 SoC for Miniature IoT Devices
Samsung on Thursday said it had begun to mass-produce its first SoC for miniature IoT devices, the Exynos i T200. Aimed at devices that do not need a lot...
16 by on 6/23/2017
GlobalFoundries Details 7 nm Plans: Three Generations, 700 mm², HVM in 2018
Keeping an eye on the ever-evolving world of silicon lithography, GlobalFoundries has recently disclosed additional details about its 7 nm generation of process technologies. As announced last September, the...
76 by on 6/23/2017
TYAN Shows Two Skylake-SP-Based HPC Servers with Up to 8 Xeon Phi/Tesla Modules
At ISC 17 this sweek, TYAN has demonstrated two new HPC servers based on the latest Intel Xeon processors for high-performance computing and deep learning workloads. The new HPC...
3 by on 6/23/2017
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