New Uses for Smartphone AI: A Short Commentary on Recording History and Privacy

This opinion piece is reactionary to recent announcements. Having just attended the Huawei keynote here at the IFA trade show, there were a couple of new features enabled through AI...

25 by Dr. Ian Cutress on 9/6/2019

Huawei Announces Kirin 990 and Kirin 990 5G: Dual SoC Approach, Integrated 5G Modem

For the last 3 years, Huawei has announced its next generation SoC at the IFA technology show here in Berlin. In every occasion, the company promotes its hardware, using...

153 by Dr. Ian Cutress on 9/6/2019

TCL Waterfall Tech Demo: Screen Edges Done Right

Modern edge display technology is a compromise between screen real estate, comfort, and aesthetics. Personally, I’ve never owned a Note, or a device with an excessive edge with edge-related...

30 by Dr. Ian Cutress on 9/5/2019

The TCL One Piece Tech Demo: The Smartphone with No Holes and No Buttons

One of the things I love about TCL is its willingness to show off internal conceptual designs to the press. It’s something we see in the car industry all...

18 by Dr. Ian Cutress on 9/5/2019

The TCL Plex Smartphone Hands-On: Dedicated Low-Light Camera for Video

As one of the world’s largest TV manufacturers, with its hands in a lot of other things, TCL is a fairly common name among certain regions of the world...

23 by Dr. Ian Cutress on 9/5/2019

Xilinx Announces World Largest FPGA: Virtex Ultrascale+ VU19P with 9m Cells

We don’t often cover the FPGA market here at AnandTech, but in the past couple of years we have seen the array of features that FPGAs are implementing expand...

17 by Dr. Ian Cutress on 8/27/2019

Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon

The final presentation of Hot Chips 31 is from Microsoft, who will be lifting the lid of the silicon behind its HoloLens 2.0 product.

5 by Dr. Ian Cutress on 8/20/2019

Hot Chips 31 Live Blogs: Intel/Tsinghua Xeon Jintide Security CPU

Doing custom x86 CPUs is nothing new: presenting one at Hot Chips is new. Here we have Tsinghua University giving a presentation on Jintide, its custom solution built upon...

9 by Dr. Ian Cutress on 8/20/2019

Hot Chips 31 Live Blogs: Intel Lakefield and Foveros

One of the interesting developments in packaging technology in recent memory is the 3D stacking of Intel's new Foveros technology. The first chip to use this packaging technology is...

31 by Dr. Ian Cutress on 8/20/2019

Hot Chips 31 Live Blogs: Gen-Z Chipset for Exascale Fabric

One of the key competing interconnects of the future is Gen-Z, and Hewlett Packard Enterprise have a Gen-Z chipset to show at Hot Chips today.

2 by Dr. Ian Cutress on 8/20/2019

Hot Chips 31 Keynote Day 2: Dr. Phillip Wong, VP Research at TSMC (1:45pm PT)

The keynote for the second day is from TSMC, with Dr. Phillip Wong taking the stage to talk about the latest developments in TSMC's research and portfolio. The talk...

9 by Dr. Ian Cutress on 8/20/2019

Hot Chips 31 Live Blogs: Intel 10nm Spring Hill NNP-I Inference Chip

One of Intel's future 10nm products is the Spring Hill NNP-I 1000 Inference Engine. Today the company is lifting the lid on some of the architecture behind the chip.

2 by Dr. Ian Cutress on 8/20/2019

Hot Chips 31 Live Blogs: Xilinx Versal AI Engine

Xilinx, the manufacturer of FPGAs, announced its new Versal AI engine last year as a way of moving FPGAs into the AI domain. This talk is set to expand...

0 by Dr. Ian Cutress on 8/20/2019

Hot Chips 31 Live Blogs: NVIDIA Multi-Chip AI Accelerator at 128 TOPS

NVIDIA announced at a VLSI conference last year that it had designed a test multi-chip solution for DNN computations. The company is explaining the technology today at Hot Chips...

2 by Dr. Ian Cutress on 8/20/2019

Hot Chips 31 Live Blogs: Tesla Solution for Full Self Driving

The first talk being live blogged at Hot Chips today is from Tesla, who are showing off their compute and redundancy solution for a fully-self driving car. We assume...

3 by Dr. Ian Cutress on 8/20/2019

Hot Chips 31 Live Blogs: Cerebras' 1.2 Trillion Transistor Deep Learning Processor

Some of the big news of today is Cerebras announcing its wafer-scale 1.2 trillion transistor solution for deep learning. The talk today goes into detail about the technology.

28 by Dr. Ian Cutress on 8/19/2019

Hot Chips 31 Live Blogs: Habana's Approach to AI Scaling

The final talk today at Hot Chips is from Habana, who is discussing its approach to how to scale AI compute.

1 by Dr. Ian Cutress on 8/19/2019

Hot Chips 31 Live Blogs: Intel Spring Crest NNP-T on 16nm TSMC

Intel is showing us some of the design features of its new ML training product, Spring Crest.

3 by Dr. Ian Cutress on 8/19/2019

Hot Chips 31 Live Blogs: Huawei Da Vinci Architecture

Huawei has already announced a range of Ascend products based on its in-house machine learning architecture, Da Vinci. Today we get a look inside the architecture.

0 by Dr. Ian Cutress on 8/19/2019

Hot Chips 31 Live Blogs: Facebook Zion Unified Training Platform

Facebook is presenting details on Zion, its next generation in-memory unified training platform.

0 by Dr. Ian Cutress on 8/19/2019

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