Intel’s 10th Gen 45W Core-H CPUs Show Up in the Acer ConceptD 7 Ezel

For users that regularly track Intel’s laptop process lines, then you will likely be used to the nomenclature that Y-series is sub 10 W, U-series is usually 15 W...

2 by Dr. Ian Cutress on 1/6/2020

Intel at CES 2020: 45W 10th Gen Mobile CPUs Soon, Tiger Lake with Xe Graphics Later

As we move into 2020, there is a lot of talk about what Intel’s 2020 plans will be. Discussions about the expansion of Intel’s 10nm process node products, such...

57 by Dr. Ian Cutress on 1/6/2020

CES 2020: Acer ConceptD 700 Workstation For Creators, With Xeon E

Through 2019, all the major hardware providers and OEMs in the spaces we cover have been pushing the idea of the ‘Creator’ – someone who needs a high powered...

5 by Dr. Ian Cutress on 1/5/2020

An Interconnected Interview with Intel’s Ramune Nagisetty: A Future with Foveros

I’ve constantly stated for the last two years that the next battleground in performance for the semiconductor market is going to be in the interconnect – whether we’re speaking...

15 by Dr. Ian Cutress on 1/3/2020

How to Tarnish Platinum: Sell It as Xeon 9200

in 2019, Intel announced its Cascade Lake family of enterprise processors, and sitting at the top of the stack was the Cascade Lake-AP family: a quartet of parts that...

103 by Dr. Ian Cutress on 1/2/2020

Taking Immersion in Gaming One Step Further: Full PC Immersion with the CoolBitts ICEbox

One of the news items that went under the radar at Supercomputing was from CoolBitts. The company focuses on fully immersed systems whereby the CPU, GPU, and all the...

30 by Dr. Ian Cutress on 12/30/2019

Kioxia: 3D Stacked Storage Class Memory, like 3D XPoint, Isn’t the Future

One of the key battlegrounds of the next decade is going to be storage: density, speed, and demand. Naturally all the major players in the space want to promote...

24 by Dr. Ian Cutress on 12/30/2019

This Smartphone Fingerprint Sensor Gets Two Thumbs (Up)

One of the cool features that came out of Qualcomm’s Tech Summit last month was its new fingerprint sensor. This one goes above and beyond anything I’ve seen before...

22 by Dr. Ian Cutress on 12/30/2019

An Interview with AMD’s CTO Mark Papermaster: ‘There’s More Room At The Top’

On the back of a very busy 2019, AMD is gaining market share and is now a performance leader in a lot of CPU segments. The company has executed...

69 by Dr. Ian Cutress on 12/30/2019

AnandTech Year In Review 2019: Lots of CPUs

Throughout 2019, we’ve had quite the reverse of performance when it comes to the competitiveness of the modern performance-oriented desktop processor. This year we’ve seen AMD introduce its Zen...

25 by Dr. Ian Cutress on 12/27/2019

Analyzing Intel’s Discrete Xe-HPC Graphics Disclosure: Ponte Vecchio, Rambo Cache, and Gelato

It has been a couple of weeks since Intel formally provided some high-level detail on its new discrete graphics strategy. The reason for the announcements and disclosures centered around...

47 by Dr. Ian Cutress on 12/24/2019

80-Core N1 Next-Gen Ampere, ‘QuickSilver’: The Anti-Graviton2

The drive to putting Arm into the server space has had its ups and downs. We’ve seen the likes of Applied Micro/Ampere, Broadcom/Cavium/Marvell, Qualcomm, Huawei, Fujitsu, Annapurna/Amazon, and even...

56 by Dr. Ian Cutress on 12/23/2019

Early TSMC 5nm Test Chip Yields 80%, HVM Coming in H1 2020

Today at the IEEE IEDM Conference, TSMC is presenting a paper giving an overview of the initial results it has achieved on its 5nm process. This process is going...

61 by Dr. Ian Cutress on 12/11/2019

EUV Wafers Processed and TwinScan Machine Uptime: A Quick Look

One of the interesting elements that came out of some of our discussions at the IEDM conference this year revolve around the present deployment of EUV. Currently only one...

28 by Dr. Ian Cutress on 12/11/2019

Intel’s Manufacturing Roadmap from 2019 to 2029: Back Porting, 7nm, 5nm, 3nm, 2nm, and 1.4 nm

One of the interesting disclosures here at the IEEE International Electron Devices Meeting (IEDM) has been around new and upcoming process node technologies. Almost every session so far this...

135 by Dr. Ian Cutress on 12/11/2019

Intel: Lakefield in 2020, Possible 5G on Foveros

At the IEEE International Electron Devices Meeting (IEDM) 2019, Intel had two package integration presentations, one on its Omni-Directional Interconnect and one on its 3D stacking Foveros technology. In...

37 by Dr. Ian Cutress on 12/11/2019

Arm Server CPUs: You Can Now Buy Ampere’s eMAG in a Workstation

One of the critical elements to all these new server-class Arm processors is availability. We are not yet at the point where these chips are freely sold on the...

19 by Dr. Ian Cutress on 12/6/2019

Preferred Networks: A 500 W Custom PCIe Card using 3000 mm2 Silicon

Pushing the physical limits of hardware is always a fun story, but I was positively blown away when I saw this poster at Supercomputing. Preferred Networks, seemingly a spin-out...

17 by Dr. Ian Cutress on 12/6/2019

Qualcomm Snapdragon Tech Summit Day 3 Live Blog: ACPC and XR

The annual Qualcomm Snapdragon Tech Summit is in its final day, and the main focal points for discussion are the Windows on Snapdragon-based Always Connected PCs, with updates to...

17 by Dr. Ian Cutress on 12/5/2019

AIC to Offer Dual Socket 1U with Four 300W FPGAs

Aside from specific events relating to Xilinx or Altera/Intel, we don’t cover much FPGA news. FPGAs by their very nature are very focused pieces of hardware, and it’s usually...

1 by Dr. Ian Cutress on 12/5/2019

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