Overclocking

With our look at the stock performance of our 280X cards complete, let’s take a brief look at overclocking.

When it comes to overclocking this is going to be a somewhat unfair competition for the two cards. The Asus card has by the very necessity of its existence already been binned. Furthermore while the Asus card supports voltage adjustments the XFX card does not (MSI Afterburner says it does, but adjusting the value has no effect). As such we get to drive what’s already a better GPU harder and with more voltage than the other. Still, this will give us the chance to see where everything will top out at.

Radeon R9 280X Overclocking
  XFX Radeon R9 280X DD Asus Radeon R9 280X DCU II TOP
Shipping Core Clock 850MHz 970MHz
Shipping Boost Clock 1000MHz 1070Mhz
Shipping Memory Clock 6GHz 6.4GHz
Shipping Boost Voltage 1.2v 1.2v
     
Overclock Core Clock 880MHz 1010MHz
Overclock Boost Clock 1030MHz 1110MHz
Overclock Memory Clock 6.6GHz 6.8GHz
Overclock Max Boost Voltage 1.2v 1.263v

As it turns out, neither card overclocked by very much. The XFX card, lacking additional voltage, could only do 30MHz more, for a 4% base/3% boost overclock. Better luck was found on the memory with a 600MHz (10%) overclock there. The Asus card meanwhile was good for 40MHz more, for a 4% base/4% boost overclock, while its memory could do an additional 800MHz (13%). But at the same time this required dialing the voltage up to 1.263v – as high as we’re willing to go for this card. The power cost of doing that will be extreme.

With our 280X cards primarily bottlenecked by GPU performance as opposed to memory performance, the performance gains from our overclocking adventure is limited. 3% on average for both cards is 3% for free, but it’s barely a useful overclock. We typically need 5% before overclocks start becoming interesting and significant enough to improve playability or make higher graphical settings practical.

To the credit of the Asus card and its cooler, despite the increased clockspeeds, voltage, and power consumption, it’s able to keep GPU temperatures and load noise to reasonable levels given the circumstances. Still, with the increase in power required to achieve this overclock (particularly in the worst case scenario of FurMark) it’s hard to argue that the additional overclocking was worth the performance gains. With such an extensive factory overclock this is a card that may be better off left at factory clocks.

The XFX card meanwhile suffers much less of a power ramp up due to the lack of voltage control, but we’re still looking at something of a wash on the power/performance front.

Power, Temperature, & Noise Final Words
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  • Dribble - Tuesday, October 8, 2013 - link

    Didn't you read the article - it is a 7970GE give or take a little on clocks (depending on what 280 you buy). The only new card is the 290 all the others are the same cards you could already buy. The news is lower prices, although as 7970's were already at lower prices then AMD recommended not sure how much real change there will be.

    The biggest downer for AMD fans will be the end of the 7950, which was always the price/performance king.
  • Da W - Tuesday, October 8, 2013 - link

    It's gonna be the R9 280 (no X).
    I might just go and buy two 7950 right now. I'm not sure a single Hawaii priced near a 780 is worth it, crossfire issues notwithstanding.
    Very disappointing. Specs I saw floating here and there pointed to 270X being more like a Tahiti XL.
  • zeock9 - Tuesday, October 8, 2013 - link

    Didn't you read my comment - 7970GE can already be had for the same price, so it's the same card for more money because 280X doesn't come with the Never Settle bundle.

    Trying to charge more buck for less bang just because it has a new name is a effing shame of a business practice.
  • ninjaquick - Tuesday, October 8, 2013 - link

    What do you expect? AMD is not releasing a new architecture this time around. They have a very efficient design in GCN, they will not go changing it. Mark my words, the 370X is going to be a die shrunk 7970 GHz, and the 460X is going to be the same, or just a 'rebadged' 370X. AMD's GCN is a bottom-up modular design, not a top-down big chip first design.
  • HisDivineOrder - Tuesday, October 8, 2013 - link

    Mantle is going to require they not stray too far from GCN and the way the cards are currently laid out. Otherwise, you'd have games suddenly having cards they're "Mantle compatible" with and cards they aren't.

    You won't see huge shifts in how the GCN is laid out post GCN 1.1 if they want to keep low level access working smoothly for the foreseeable future. Then again, perhaps they'll do the shift and just shift back to supporting their high level (drivers) instead once Mantle craters on impact because nVidia and Intel start throwing their money around...

    Either way, I'm pretty sure Mantle is a cost-cutting tool to help de-emphasize driver development on the consumer side and help keep up with performance gains by aggressive nVidia and intel release cycles that AMD doesn't have the money to fight.
  • roastmeat - Tuesday, July 21, 2015 - link

    Ha, well what do you know

    The 370 is a rebadge
  • chizow - Tuesday, October 8, 2013 - link

    "AMD has been very explicit in not calling these rebadges, and technically they are correct, but all of these products should be very familiar to our regular readers."

    So how are these not rebadges/rebrands again and how is it technically correct to not call them rebadges? I just find it funny that AMD was so explicit about not calling them as such, I mean it's clear both parties have a history of rebranding, but let's call a spade a spade here.

    Nvidia was pounded by AMD fanboys and the press alike for it's rebranding of G92, but any single iteration from G92 certainly had more changes than the non-existent changes we see with this R7/R9 rebrand stack.
  • Ryan Smith - Tuesday, October 8, 2013 - link

    A rebadge would be something like the 5770 to 6770. Same card, same clocks, same TDP. These are new SKUs, based on existing GPUs, under a new name.
  • chizow - Tuesday, October 8, 2013 - link

    lol I guess we have some revisionist history that needs to be written then. Not blaming you of course for public perception, just saying, these were not the standards in G92's day as it easily cleared this very low standard of different clockspeeds/TDP/card design, as every single G92 incarnation surpassed these requirements.

    In any case, I did appreciate the in-depth coverage of Mantle, possible benefits, repercussions, downsides. Excellent coverage and commentary on all angles, as usual. Look forward to more detail about it in the future.
  • Gigaplex - Tuesday, October 8, 2013 - link

    If the silicon isn't any different, the only distinction is in the board itself and the firmware setting the speeds etc, then it's a rebadge in my books. Nothing stopping OEMs from changing these around, and this does in fact happen with the OC cards. What is the difference between a rebadged chip with an OC vs one of these?

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