Samsung and TSMC Roadmaps: 8 and 6 nm Added, Looking at 22ULP and 12FFC

Not Everyone Needs Leading Edge: TSMC’s 22 nm ULP, 12 nm FFC and 12 nm FFC+

Now let’s discuss something less advanced, but what is required for hundreds of millions of devices sold every year.

Development of FinFET-based chips is more expensive of ICs featuring planar transistors and their manufacturing is more costly as well. As a result, FinFET is virtually unavailable for many smaller designers of SoCs that usually build various solutions for emerging IoT applications. GlobalFoundries and Samsung offer their FD-SOI manufacturing processes to such companies (and these technologies have a number of other advantages in addition to being more cost-effective), whereas TSMC intends to introduce its new 22 nm ULP technology aimed at such applications. The CLN22ULP is an optimized version of the company’s 28 nm HPC+ (high-performance compact plus) manufacturing process that has been available for a while. The 22ULP offers a 10% area reduction and either a 15% performance improvement over the 28HPC+ process, or a 35% power drop. The 22ULP process joins a family of other ultra-low-power processes offered by TSMC and will compete against GlobalFoundries 22FDX as well as Samsung’s 28 nm FD-SOI offering.

Next up is TSMC’s 12 nm FFC manufacturing technology, which is an optimized version of the company’s CLN16FFC that is set to use 6T libraries (as opposed to 7.5T and 9T libraries) providing a 20% area reduction. Despite noticeably higher transistor density, the CLN12FFC is expected to also offer a 10% frequency improvement at the same power and complexity or a 25% power reduction at the same clock rate and complexity. Further down the road, TSMC also plans to offer a ULP version of the CLN12FFC with reduced voltage, but that is going to happen only in 2018 or 2019.

Sources: Samsung, TSMC, SemiWiki (1, 2, 3).

Related Reading:

• Samsung Foundry Announces 10nm SoC In Mass-Production
• Samsung Announces Second-Gen 14nm Low Power Plus (14LPP) Process Now In Mass Production
• EUV Lithography Makes Good Progress, Still Not Ready for Prime Time
• GlobalFoundries to Expand Capacities, Build a Fab in China
• Intel to Equip Fab 42 for 7 nm
• GlobalFoundries Updates Roadmap: 7 nm in 2H 2018, EUV Sooner Than Later?