Testing Methodology

Although the testing of a cooler appears to be a simple task, that could not be much further from the truth. Proper thermal testing cannot be performed with a cooler mounted on a single chip, for multiple reasons. Some of these reasons include the instability of the thermal load and the inability to fully control and or monitor it, as well as the inaccuracy of the chip-integrated sensors. It is also impossible to compare results taken on different chips, let alone entirely different systems, which is a great problem when testing computer coolers, as the hardware changes every several months. Finally, testing a cooler on a typical system prevents the tester from assessing the most vital characteristic of a cooler, its absolute thermal resistance.

The absolute thermal resistance defines the absolute performance of a heatsink by indicating the temperature rise per unit of power, in our case in degrees Celsius per Watt (°C/W). In layman's terms, if the thermal resistance of a heatsink is known, the user can assess the highest possible temperature rise of a chip over ambient by simply multiplying the maximum thermal design power (TDP) rating of the chip with it. Extracting the absolute thermal resistance of a cooler however is no simple task, as the load has to be perfectly even, steady and variable, as the thermal resistance also varies depending on the magnitude of the thermal load. Therefore, even if it would be possible to assess the thermal resistance of a cooler while it is mounted on a working chip, it would not suffice, as a large change of the thermal load can yield much different results.

Appropriate thermal testing requires the creation of a proper testing station and the use of laboratory-grade equipment. Therefore, we created a thermal testing platform with a fully controllable thermal energy source that may be used to test any kind of cooler, regardless of its design and or compatibility. The thermal cartridge inside the core of our testing station can have its power adjusted between 60 W and 340 W, in 2 W increments (and it never throttles). Furthermore, monitoring and logging of the testing process via software minimizes the possibility of human errors during testing. A multifunction data acquisition module (DAQ) is responsible for the automatic or the manual control of the testing equipment, the acquisition of the ambient and the in-core temperatures via PT100 sensors, the logging of the test results and the mathematical extraction of performance figures.

Finally, as noise measurements are a bit tricky, their measurement is being performed only manually. Fans can have significant variations in speed from their rated values, thus their actual speed during the thermal testing is being acquired via a laser tachometer. The fans (and pumps, when applicable) are being powered via an adjustable, fanless desktop DC power supply and noise measurements are being taken 1 meter away from the cooler, in a straight line ahead from its fan engine. At this point we should also note that the Decibel scale is logarithmic, which means that roughly every 3 dB(A) the sound pressure doubles. Therefore, the difference of sound pressure between 30 dB(A) and 60 dB(A) is not "twice as much" but nearly a thousand times greater. The table below should help you cross-reference our test results with real-life situations.

The noise floor of our recording equipment is 30.2-30.4 dB(A), which represents a medium-sized room without any active noise sources. All of our acoustic testing takes place during night hours, minimizing the possibility of external disruptions.

<35dB(A) Virtually inaudible
35-38dB(A) Very quiet (whisper-slight humming)
38-40dB(A) Quiet (relatively comfortable - humming)
40-44dB(A) Normal (humming noise, above comfortable for a large % of users)
44-47dB(A)* Loud* (strong aerodynamic noise)
47-50dB(A) Very loud (strong whining noise)
50-54dB(A) Extremely loud (painfully distracting for the vast majority of users)
>54dB(A) Intolerable for home/office use, special applications only.

*noise levels above this are not suggested for daily use

The AMD Coolers Testing Results, Maximum Fan Speed (12 Volts)
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  • bigboxes - Friday, July 22, 2016 - link

    Yup. My Athlon X2 4400+ (Toledo) came with a 4-pipe cooler as well. Never used the stock HSF when it was in my main rig. Got a Zalman which was badass at the time. Used the stock HSF when I moved the Athlon 3200+ (Winchester) to my file server.
  • Marburg U - Friday, July 22, 2016 - link

    OK, but just to recall that DB scale is a logarithmic scale. And the difference between 44.7 and 46.3 is roughly 45% power ratio!!!
  • ZeDestructor - Friday, July 22, 2016 - link

    Perceptually though, odds are you won't observe a difference in loudness (tone is a whole different ballgame): 3dB is the generally accepted number for human hearing to be able to perceive a difference in volume, and 10dB for a perceptual halving of volume.
  • DanNeely - Friday, July 22, 2016 - link

    But also remember that your ears are a logarithmic sensor. So while 10 dB is 10x the sound intensity, it only sounds twice as loud. In this case the 1.6 dB only corresponds to sounding about 15% louder; which is barely noticeable. Other factors like your case material (type, thickness, if sound deadening material is present, locations of fan holes, etc) affecting how much sound gets out from the CPU cooler; and the number, type, and layout if your case fans affecting how hot the internal ambient is and how hard your CPU cooler has to work will all have more significant impacts on how loud your system is.
  • pseudoid - Friday, July 22, 2016 - link

    Ummmmm....
    Logarithmic scale to measure Sound Pressure Levels (SPL) are normally a relative measurement based on voltage (not power). As such, an order of magnitude increase (10X) results in a 20dB (not 10dB) increase in SPL. Keeping with the same SPL measurements, a doubling (octave) or an increase of twice as loud (2x) is a 6dB increase! No need to bring up Fletcher-Munson curves into this correction. Cheers!
  • hailey14 - Friday, July 22, 2016 - link

    "With bulk PC orders it is, of course, a "difference" scenario..."

    some typo.
  • Calculatron - Friday, July 22, 2016 - link

    Wow, I knew the Wraith cooler is good, but I didn't realize that it was that good.

    I have the "quiet" 125 TDP cooler solution, which is the Wraith Cooler without the fancy shroud - same heatsink and fan, though. Maybe I'll keep it around...
  • Lolimaster - Friday, July 22, 2016 - link

    The thing intel non 2011 socket cpu's uses complete trash internal dissipation compound, another reason to not sell it with stock cooler.

    Even with a decent one (juper 212z) you see load temps of 75°C without OC. Meanwhile their new Broadwell-E stays within the 50°C (+/- 2°C) with a similar cooler.

    AMD didn't screw up users with the IHS dissipation.
  • ZeDestructor - Sunday, July 24, 2016 - link

    As many have stated before, Intel has to use TIM on the small cores because the small cores crack from repeated thermal shock when soldered to the IHS. Intel doesn't want to screw you over, but they literally have to! Or do you want 32nm and larger lithographies back?
  • Ascaris - Sunday, July 24, 2016 - link

    They could use a bigger chunk of silicon wafer to help with heat dissipation/bond to the IHS without printing anything on it. It's not as if the smaller litho chips have gotten cheaper because of less silicon usage!

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