Micron Introduces 128 GB DDR5-8000 RDIMMs with Monolithic 32 Gb Die
The path to high-capacity RDIMMs for servers has primarily been through 3D stacking (3DS) of DRAM dies using Through-Silicon Vias (TSVs). However, this has presented significant challenges in packaging...
15 by Ganesh T S on 11/9/2023
Intel Abandons Development of Sub-Ambient Cryo Cooling Tech
In an update posted to its support pages, Intel has disclosed that it had stopped development of its thermoelectric Cryo Cooling Technology that was aimed to provide sub-ambient cooling...
10 by Anton Shilov on 11/8/2023
Seagate's HAMR Update: 32 TB in Early 2024, 40+ TB Two Years Later
Hidden deep in Seagate's financial report released late last month was a brief roadmap update for the company's heat-assisted magnetic recording (HAMR) technology. As noted in the latest update...
11 by Anton Shilov on 11/8/2023
AMD Begins Polaris and Vega GPU Retirement Process, Reduces Ongoing Driver Support
As AMD is now well into their third generation of RDNA architecture GPUs, the sun has been slowly setting on AMD’s remaining Graphics Core Next (GCN) designs, better known...
32 by Ryan Smith on 11/8/2023
AMD's EPYC 7003 "Milan" Receives Extended Lifecycle: Availability To 2026 With 6 New SKUs
AMD has sent word over this morning that the company is extending the product lifecycle for their previous-generation EYPC 7003 “Milan” family of server CPUs. The company will now...
4 by Ryan Smith on 11/7/2023
Arm Acquires Minority Stake in Raspberry Pi
Arm Holdings has acquired a minority stake in Raspberry Pi Ltd, reinforcing a partnership that began in 2008. This strategic investment is designed to support development of Raspberry Pi's...
11 by Anton Shilov on 11/3/2023
Samsung's Next-Gen 3nm and 4nm Nodes on Track for Mass Production in 2H 2024
Samsung is set to start making chips using its 2nd Generation 3nm-class (SF3) manufacturing technology as well as performance-enhanced version of its 4nm-class (SF4X) fabrication process in the second...
9 by Anton Shilov on 11/2/2023
Western Digital to Split HDD and NAND Businesses
Western Digital has announced its decision to split its hard disk drive and NAND memory businesses, creating two separate public companies. According to the company, the change is aimed...
12 by Anton Shilov on 10/31/2023
Crucial T500 Gen4 NVMe SSD: New Flagship Melds Micron 232L 3D TLC and Phison E25
Crucial is unveiling its latest addition to its Gen4 consumer NVMe SSD lineup today - the T500 PCIe 4.0 M.2 2280 NVMe SSD. It takes over flagship duties from...
20 by Ganesh T S on 10/31/2023
Solidigm Lays Off Employees Due to Industry Downturn
The solid state storage industry has been in a well-documented slide for the better part of the last year now. With storage product demand from both the client and...
18 by Anton Shilov on 10/25/2023
Micron and SK hynix Ship LPDDR5-9600 Memory for Next-Gen Smartphones
Fast memory is crucial for the performance of high-end system-on-chips that are getting more sophisticated every year. When it comes to smartphones, the most obvious way to boost memory...
23 by Anton Shilov on 10/25/2023
Report: AMD and NVIDIA Set to Offer Arm-Based Processors for PCs
Apple's release of Arm-based system-on-chips for its desktops and laptops three years ago demonstrated that such processors could offer competitive performance and power consumption. On the Windows-based PC front...
43 by Anton Shilov on 10/25/2023
Samsung Announces 'Shinebolt' HBM3E Memory: HBM Hits 36GB Stacks at 9.8 Gbps
Samsung’s annual Memory Tech Day is taking place in San Jose this morning, and as part of the event, the company is making a couple of notable memory technology...
10 by Ryan Smith on 10/20/2023
Zotac's Zbox Pico PI430AJ Uses Frore's AirJet Solid-State Active Cooling
Zotac has introduced the industry's first compact PC featuring Frore's AirJet solid-state cooling system. Zotac's ultra-compact Zbox Pico PI430AJ is powered by Intel's Core i3 processor is designed primarily...
18 by Anton Shilov on 10/20/2023
TSMC Q3 Earnings: 3nm Production Node Accounts for 6% of Revenue
Although Taiwan Semiconductor Manufacturing Co. formally started production of chips using its N3 (3nm-class) process technology back in late 2022, the company did not recognize any meaningful N3 revenue...
7 by Anton Shilov on 10/19/2023
Seagate Unveils Exos X24 24TB and 28 TB: Setting the Stage for HAMR HDDs
Seagate on Wednesday introduced its Exos X24 family of hard drives, it's highest capacity series of drives to date. The new family is comprised of both conventional magnetic recording...
16 by Anton Shilov on 10/19/2023
Arm Total Design to Facilitate Development of Custom Datacenter SoCs
Arm this week introduced its Arm Total Design initiative, which is aimed at accelerating development of custom datacenter-oriented system-on-chip (SoC) designs using Neoverse Compute Subsystems (CSS). The collaborative ecosystem...
1 by Anton Shilov on 10/18/2023
Qualcomm Swaps Out Arm for RISC-V for Next-Gen Google Wear OS Devices
As part of a broad collaborative agreement with Google, Qualcomm this week said that that it will be adopting the RISC-V instruction set architecture (ISA) for a future Snapdragon...
9 by Anton Shilov on 10/18/2023
Canon Prepares Nanoimprint Lithography Tool To Challenge EUV Scanners
Canon has recently revealed its FPA-1200NZ2C, a nanoimprint semiconductor manufacturing tool that can be used to make advanced chips. The device uses nanoimprint lithography (NIL) technology as an alternative...
14 by Anton Shilov on 10/17/2023
Intel Announces 14th Gen Core Series For Desktop: Core i9-14900K, Core i7-14700K and Core i5-14600K
Ahead of tomorrow's full-scale launch, Intel this afternoon is pre-announcing their 14th Generation Core desktop processors. Aptly codenamed Raptor Lake Refresh, these new chips are based on Intel's existing...
30 by Gavin Bonshor on 10/16/2023
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