2023 Interposers: TSMC Hints at 3400mm2 + 12x HBM in one Package
High-performance computing chip designs have been pushing the ultra-high-end packaging technologies to their limits in the recent years. A solution to the need for extreme bandwidth requirements in the...
35 by Andrei Frumusanu on 8/25/2020
TSMC Expects 5nm to be 11% of 2020 Wafer Production (sub 16nm)
One of the measures of how quickly a new process node gains traction is by comparing how many wafers are in production, especially as that new process node goes...
13 by Dr. Ian Cutress on 8/25/2020
TSMC’s Version of EMIB is ‘LSI’: Currently in Pre-Qualification
Whilst process node technologies and Moore’s Law are slowing down, manufacturers and chip designers are looking to new creative solutions to further enable device and performance scaling. Advanced packaging...
19 by Andrei Frumusanu on 8/25/2020
TSMC Teases 12-High 3D Stacked Silicon: SoIC Goes Extreme
I’ve maintained for a couple of years now that the future battleground when it comes to next-generation silicon is going to be in the interconnect – implicitly this relies...
15 by Dr. Ian Cutress on 8/25/2020
be quiet! Announces Dark Power Pro 12 PSUs: 80Plus Titanium, Up to 1500W
The increasingly popular German hardware manufacturer be quiet! has announced its latest series in its ever-growing power supply line-up, the Dark Power Pro 12. Equipped with fully digital hardware...
15 by Gavin Bonshor on 8/25/2020
TSMC Updates on Node Availability Beyond Logic: Analog, HV, Sensors, RF
Most of the time when we speak about semiconductor processes, we are focused on the leading edge of what is possible. Almost exclusively that leading edge is designed for...
3 by Dr. Ian Cutress on 8/25/2020
Crucial Launches X6 Portable SSD, Updates X8 with 2TB Model: QLC Drives for the Budget-Conscious
Crucial introduced their first bus-powered direct-attached storage product last year - the X8 Portable SSD. The product put their P1 NVMe SSD behind an ASMedia bridge to offer read...
8 by Ganesh T S on 8/25/2020
TSMC Details 3nm Process Technology: Full Node Scaling for 2H22 Volume Production
At TSMC’s annual Technology Symposium, the Taiwanese semiconductor manufacturer detailed characteristics of its future 3nm process node as well as laying out a roadmap for 5nm successors in the...
58 by Andrei Frumusanu on 8/24/2020
Intel Moving to Chiplets: ‘Client 2.0’ for 7nm
One of the more esoteric elements of Intel’s Architecture Day 2020 came very near the end, where Intel spent a few minutes discussing what it believes is the future...
67 by Dr. Ian Cutress on 8/21/2020
Intel’s New 224G PAM4 Transceivers
One battleground in the world of FPGAs is the transceiver – the ability to bring in (or push out) high speed signals onto an FPGA at low power. In...
12 by Dr. Ian Cutress on 8/21/2020
Intel’s Future 7nm FPGAs To Use Foveros 3D Stacking
One of the main battlegrounds of future leading-edge semiconductor products will be in the packaging technology: being able to integrate multiple elements of silicon onto the same package with...
11 by Dr. Ian Cutress on 8/21/2020
Cerebras Wafer Scale Engine News: DoE Supercomputer Gets 400,000 AI Cores
One of the more interesting AI silicon projects over the last couple of years has been the Cerebras Wafer Scale Engine, most notably for the fact that a single...
8 by Dr. Ian Cutress on 8/21/2020
Intel Xe-HP Graphics: Early Samples Offer 42+ TFLOPs of FP32 Performance
One of the promises that Intel has made with its new Xe GPU family is that in its various forms it will cater to uses ranging from integrated graphics...
43 by Dr. Ian Cutress on 8/21/2020_carousel.jpg)
Intel’s SG1 is 4x DG1: Xe-LP Graphics for Server Video Acceleration and Streaming
For the last few years, Intel has had a product line known as the Visual Computing Accelerator (VCA). With the VCA2 product being put on EOL earlier this year...
10 by Dr. Ian Cutress on 8/21/2020
Western Digital's USB 3.1 Gen 2 WD My Passport SSD Gets an NVMe Refresh
Western Digital's lineup of direct-attached storage (DAS) products targets a range of markets and form-factors. After the acquisition of HGST / G-Technology and SanDisk, the company now offers similar...
20 by Ganesh T S on 8/20/2020
NVIDIA Reports Q2 FY2021 Earnings: Datacenter Revenue Surpasses Gaming for the First Time
This afternoon NVIDIA announced their results for the second quarter of their 2021 fiscal year, closing out on an exceptional quarter for the company that set numerous revenue records...
35 by Ryan Smith on 8/19/2020
Mandatory Socialization: Facebook Accounts To be Required for Oculus Headsets
Signaling the end to any remaining degrees of separation between Facebook and its VR headset division, Oculus, today the social media company announced that it will be further integrating...
73 by Ryan Smith on 8/18/2020
Hot Chips 2020 Live Blog: Silicon Photonics for AI (6:00pm PT)
Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...
6 by Dr. Ian Cutress on 8/18/2020
Hot Chips 2020 Live Blog: Alibaba's Hanguang 800 NPU (5:00pm PT)
Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...
1 by Dr. Ian Cutress on 8/18/2020
Hot Chips 2020 Live Blog: Baidu Kunlun AI Processor (4:30pm PT)
Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...
3 by Dr. Ian Cutress on 8/18/2020
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