TSMC
TSMC's 3D-stacked system-on-integrated chips (SoIC) advanced packaging technologies is set to evolve rapidly. In a presentation at the company's recent technology symposium, TSMC outlined a roadmap that will take the technology from a current bump pitch of 9μm all the way down to a 3μm pitch by 2027, stacking together combinations of A16 and N2 dies. TSMC has a number of advanced packaging technologies, including 2.5D CoWoS and 2.5D/3D InFO. Perhaps the most intriguing (and complex) method is their 3D-stacked system-on-integrated chips (SoIC) technology, which is TSMC's implementation of hybrid wafer bonding. Hybrid bonding allows two advanced logic devices to be stacked directly on top of each other, allowing for ultra-dense (and ultra-short) connections between the two chips, and is primarily aimed at high performance...
TSMC to Build Second Fab in Japan: 6nm and 7nm Coming to Japan
Taiwan Semiconductor Manufacturing Co. on Tuesday formally announced plans to build a second fab in Japan. The fab will be run by Japan Advanced Semiconductor Manufacturing (JASM), a majority-owned...
4 by Anton Shilov on 2/6/2024
TSMC 2nm Update: Two Fabs in Construction, One Awaiting Government Approval
When Taiwan Semiconductor Manufacturing Co. (TSMC) is prepping to roll out an all-new process technology, it usually builds a new fab to meet demand of its alpha customers and...
38 by Anton Shilov on 1/19/2024
TSMC Posts Q4'23 Earnings: 3nm Revenue Share Jumps to 15%, 5nm Overtakes 7nm For 2023
Taiwan Semiconductor Manufacturing Co. released its Q4'2023 and full year 2023 financial results this week. And along with a look at the financial state of the firm as it...
2 by Anton Shilov on 1/19/2024
TSMC Solidifies Leadership on Foundry Market as Intel Jumps into Top 10
The global foundry industry witnessed a substantial rise in demand in the third quarter of 2023, according to TrendForce. The Top 10 foundries collectively saw their revenue soar to...
7 by Anton Shilov on 12/6/2023
TSMC Q3 Earnings: 3nm Production Node Accounts for 6% of Revenue
Although Taiwan Semiconductor Manufacturing Co. formally started production of chips using its N3 (3nm-class) process technology back in late 2022, the company did not recognize any meaningful N3 revenue...
7 by Anton Shilov on 10/19/2023
TSMC: We Want OSATs to Expand Their Advanced Packaging Capability
Almost since the inception of the foundry business model in the late 1980s, TSMC would produce silicon. In contrast, an outsourced semiconductor assembly and test (OSAT) service provider would...
2 by Anton Shilov on 10/16/2023
TSMC: Ecosystem for 2nm Chip Development Is Nearing Completion
Speaking to partners last week as part of their annual Open Innovation Platform forum in Europe, a big portion of TSMC's roadshow was dedicated to the next generation of...
20 by Anton Shilov on 10/12/2023
HBM4 in Development, Organizers Eyeing Even Wider 2048-Bit Interface
High-bandwidth memory has been around for about a decade, and throughout its its continued development it has steadily increased in speed, starting at a data transfer rate from 1...
11 by Anton Shilov on 10/12/2023
TSMC: Importance of Open Innovation Platform Is Growing, Collaboration Needed for Next-Gen Chips
This year TSMC is commemorating 15 years of its Open Innovation Platform, a multi-faceted program that brings together the foundry's suppliers, partners, and customers to help TSMC's customers better...
4 by Anton Shilov on 10/12/2023
TSMC Buys 10% Stake in IMS Nano from Intel
Intel and TSMC have announced an agreement in which TSMC will acquire a 10% stake in IMS Nanofabrication. IMS, controlled by Intel, produces multi e-beam photomask writing tools, whose...
0 by Anton Shilov on 9/12/2023
TSMC: Short Supply of HPC GPUs to Persist for 1.5 Years
The reports about an insufficient supply of compute GPUs used for artificial intelligence (AI) and high-performance computing (HPC) servers became common in recent months as demand for GPUs to...
6 by Anton Shilov on 9/7/2023
ASML to Deliver First High-NA EUV Tool This Year
In a promising sign for the development of the next generation of EUV lithography machines, ASML has revealed that the company is set to deliver the industry's first High-NA...
7 by Anton Shilov on 9/6/2023
TSMC Establishes Joint Venture to Build 12nm/16nm Fab in Europe
TSMC on Tuesday announced plans to establish a European Semiconductor Manufacturing Company (ESMC) joint venture with its partners Bosch, Infineon, and NXP to build a fab near Dresden, Germany...
10 by Anton Shilov on 8/8/2023
Dozens of Companies Adopt TSMC's 3nm Process Technology
Designing chips for modern, leading-edge manufacturing technologies is an expensive endeavor. Still, dozens of companies have already adopted TSMCs N3 and N3E (3 nm-class) fabrication processes, according to disclosures...
9 by Anton Shilov on 7/28/2023
TSMC to Build $2.87 Billion Facility For Advanced Chip Packaging
TSMC on Tuesday announced plans to construct a new advanced chip packaging facility in Tongluo Science Park. The company intends to spend around $2.87 billion on the fab that...
3 by Anton Shilov on 7/25/2023
TSMC: 3nm Chips for Smartphones and HPCs Coming This Year
While TSMC formally started mass production of chips on its N3 (3nm-class) process technology late last year, the company is set to finally ship the first revenue wafers in...
21 by Anton Shilov on 7/21/2023
TSMC Delays Arizona Fab Deployment to 2025, Citing Shortage of Skilled Workers
TSMC on Thursday disclosed that it will have to delay mass production at its Fab 21 in Arizona to 2025, as a lack of suitably skilled workers is slowing...
27 by Anton Shilov on 7/20/2023
Top 10 Foundries See Revenue Drop Nearly 15% Year-over-Year
The top 10 contract makers of chips saw their Q1 2023 revenue decline by 14.6% year-over-year and 18.6% quarter-over-quarter, according to the most recent report by TrendForce. The market...
0 by Anton Shilov on 6/13/2023
TSMC Opens Advanced Backend Packaging Fab for AI and HPC Products
TSMC on Friday formally opened its Advanced Backend Fab 6 facility, which it will be using to expand the company's capacity for building high-end, multi-chiplet products. The facility is...
1 by Anton Shilov on 6/9/2023
TSMC Shares More Info on 2nm: New MIM Capacitor and Backside PDN Detailed
TSMC has revealed some additional details about its upcoming N2 and N2P process technology at its European Technology Symposium 2023. Both production nodes are being developed with high-performance computing...
15 by Anton Shilov on 5/31/2023
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