Memory
Samsung Electronics has started mass production of its 9th generation of V-NAND memory. The first dies based on their latest NAND tech come in a 1 Tb capacity using a triple-level cell (TLC) architecture, with data transfer rates as high as 3.2 GT/s. The new 3D TLC NAND memory will initially be used to build high-capacity and high-performance SSDs, which will help to solidify Samsung's position in the storage market. Diving right in, Samsung is conspicuously avoiding to list the number of layers in their latest generation NAND, which is the principle driving factor in increasing capacity generation-on-generation. The company's current 8th gen V-NAND is 236 layers – similar to its major competitors – and word on the street is that 9th gen V-NAND ups...
GeiL Unveils 64 GB DDR4-3200 SO-DIMM Kit, 2 x 32 GB
Memory manufacturer Golden Emporer International Limited, or known generally as GeiL, has announced its new memory line with support for Intel 10th Gen and AMD Ryzen 4000 series processors...
21 by Gavin Bonshor on 5/5/2020XPG Spectrix D50 Memory: A More Subtle RGB DDR4
ADATA's XPG division has unveiled its latest addition in the high-performance DRAM segment, the Spectrix D50. Starting from 8 GB DDR4-3000 modules, the latest Spectrix D50 kits will go...
22 by Gavin Bonshor on 4/15/2020ADATA's New 32 GB DDR4-3200 SO-DIMM, Ideal for Ryzen Mobile
ADATA, one of the leading manufacturers of DRAM and NAND products, has just unveiled its latest memory modules. The new ADATA DDR4-3200 32 GB parts are available in both...
41 by Gavin Bonshor on 4/15/2020China Develops High Capacity QLC 3D NAND: YMTC at 1.33 Tb
Yangtze Memory Technologies Co. (YMTC) has announced that it's developed its new 128-layer 1.33 Tb QLC 3D NAND memory chip, the X2-6070. The new chip is based on its...
64 by Gavin Bonshor on 4/13/2020SK Hynix: We're Planning for DDR5-8400 at 1.1 Volts
Back in November last year, we reported that SK Hynix had developed and deployed its first DDR5 DRAM. Fast forward to the present, and we also know SK Hynix...
86 by Gavin Bonshor on 4/3/2020Micron to Start Volume Production of 128-Layer 3D NAND with RG Architecture This Quarter
As part of the company's second quarter financial earnings call, Micron has revealed that it is about to start volume production of its 4th Generation 3D NAND memory devices...
10 by Anton Shilov on 4/1/2020Cadence DDR5 Update: Launching at 4800 MT/s, Over 12 DDR5 SoCs in Development
JEDEC still has not published the DDR5 specification officially, yet it looks like DRAM makers and SoC designers are preparing for the DDR5 launch at full steam. Cadence, which...
20 by Anton Shilov on 3/27/2020TeamGroup Announces 32GB T-Force Vulcan Z and Dark Z DDR4 Modules
One of the world's largest DRAM memory manufacturers TeamGroup has unveiled its first DDR4 memory kits featuring 32 GB sticks under its gaming-focused T-Force brand. The T-Force Vulcan Z...
7 by Gavin Bonshor on 3/27/2020Samsung to Produce DDR5 in 2021 (with EUV)
Samsung is on track to start volume production of DDR5 and LPDDR5 memory next year using a manufacturing technology that will take advantage of extreme ultraviolet lithography (EUVL). In...
20 by Anton Shilov on 3/25/2020GlobalFoundries & Everspin Extend MRAM Pact to 12nm
GlobalFoundries and Everspin have announced that the two have extended their Spin-transfer Torque (STT-MRAM) joint development agreement (JDA) to 12LP (12 nm FinFET) platform. The extension will enable GlobalFoundries...
4 by Anton Shilov on 3/13/2020Rambus Develops HBM2E Controller & PHY: 3.2 Gbps, 1024-Bit Bus
The latest enhancements to the HBM2 standard will clearly be appreciated by developers of memory bandwidth-hungry ASICs, however in order to add support of HBM2E to their designs, they...
42 by Anton Shilov on 3/6/2020ATP’s DDR4-3200 Industrial DIMMs: Up to 128GB @ 1.2V for AMD & Intel
ATP has unveiled its latest memory modules for servers and industrial applications, boasting a 3200 MT/s data transfer rate, an industry-standard voltage, and capacities ranging from 2 GB to...
7 by Anton Shilov on 3/5/2020Samsung Starts Production of 16 GB LPDDR5-5500 for Smartphones
Samsung has begun mass production of the industry’s first 16 GB LPDDR5 memory for upcoming smartphones, such as the Galaxy S20 Ultra 5G handsets. The new DRAM devices not...
33 by Anton Shilov on 2/25/2020SMART Modular Reveals 32 GB DDR4-3200 Low Profile Mini-DIMMs for Extreme Environments
SMART Modular has unveiled a new lineup of 32 GB Mini-DIMMs for extreme environments, such as industrial or telecommunication applications. The new high-density modules come in ULP (Ultra Low...
7 by Anton Shilov on 2/14/2020G.Skill Launches 256 GB DDR4-3600 CL16 Memory Kit
The arrival of 32 GB unbuffered DIMMs has not only allowed mainstream systems to reach 128 GB of memory, but it's also allowed high-end desktops based on AMD Ryzen...
8 by Anton Shilov on 2/12/2020SK Hynix Licenses DBI Ultra Interconnect for Next-Gen 3DS and HBM DRAM
SK Hynix has inked a new broad patent and technology licensing agreement with Xperi Corp. Among other things, the company licensed the DBI Ultra 2.5D/3D interconnect technology developed by...
9 by Anton Shilov on 2/11/2020GIGABYTE Launches Designare DDR4-3200 Memory, a 64 GB Kit
GIGABYTE is a relatively new player on the memory market, yet it clearly wants to participate in the premier league. As seen at CES, this week the company introduced...
23 by Anton Shilov on 2/6/2020Micron Shipping LPDDR5 DRAM
Micron has announced their first LPDDR5 DRAM is in mass production and now shipping to customers. The new RAM is significantly faster and more power efficient than LPDDR4x. One...
33 by Billy Tallis on 2/6/2020JEDEC Updates HBM2 Memory Standard To 3.2 Gbps; Samsung's Flashbolt Memory Nears Production
After a series of piecemeal announcements from different hardware vendors over the past year, the future of High Bandwidth Memory 2 (HBM2) is finally coming into focus. Continuing the...
24 by Ryan Smith on 2/3/2020SK Hynix to Cut CapEx, Accelerate Transitions, 1z nm DRAM & 128L 4D NAND in 2020
Following a massive revenue and profitability drop in 2019, SK Hynix has announced that it plans to cut down its capital expenditures. While the market has shown some signs...
6 by Anton Shilov on 2/3/2020