Memory
Samsung Electronics has started mass production of its 9th generation of V-NAND memory. The first dies based on their latest NAND tech come in a 1 Tb capacity using a triple-level cell (TLC) architecture, with data transfer rates as high as 3.2 GT/s. The new 3D TLC NAND memory will initially be used to build high-capacity and high-performance SSDs, which will help to solidify Samsung's position in the storage market. Diving right in, Samsung is conspicuously avoiding to list the number of layers in their latest generation NAND, which is the principle driving factor in increasing capacity generation-on-generation. The company's current 8th gen V-NAND is 236 layers – similar to its major competitors – and word on the street is that 9th gen V-NAND ups...
GeIL Launches Evo Spear Phantom Gaming Edition Memory, Designed For SFF Systems
Following on from a wide range of ASRock Phantom Gaming branded products, memory manufacturer GeIL has announced its new Evo Spear Phantom Gaming Edition memory, which is designed for...
7 by Gavin Bonshor on 5/17/2019
KLEVV Cras X RGB: Up to DDR4-4266, Coming at Computex
KLEVV, a partner business of SK Hynix, has always been rather conservative when it comes to speed bins of its memory modules for gamers and overclockers, partly because the...
8 by Anton Shilov on 5/15/2019
Samsung Samples 32 Gb DDR4 Memory Chips
Samsung recently began sampling of its DDR4 memory chips featuring a 32 Gb capacity. The new products will simplify production of high-capacity memory modules that use multiple DRAM packages.
8 by Anton Shilov on 5/15/2019
Samsung to End B-Die DDR4: The Overclockers' Favorite
For many years leading DRAM module manufacturers have used Samsung’s B-die 8 Gb memory chips for their fastest and most advanced DIMMs. This quarter Samsung intends to discontinue production...
16 by Anton Shilov on 5/14/2019
SMART Modular Announces 32 GB SO-DIMMs for Extreme Environments
SMART Modular has introduced the industry’s first industrial-grade 32 GB DDR4 SO-DIMMs. The memory modules are aimed at ruggedized computing applications that require top-of-the-line capacity modules with improved reliability.
2 by Anton Shilov on 5/9/2019
Micron to Pay Intel $1.3B to $1.5B for IM Flash Stake
Earlier this year, Micron announced their intention to buy out Intel's stake of their memory technology joint venture, IM Flash Technologies. Now, as the process gets underway, Micron is...
26 by Anton Shilov on 5/8/2019
SK Hynix to Start Using 2nd Gen 10nm-class DRAM Process Technology in 2H 2019
As part of their Q1'19 earnings announcement, SK Hynix has disclosed that the company will both increase its output of DRAM made using its 1st generation 10 nm-class manufacturing...
4 by Anton Shilov on 4/25/2019
HyperX Releases Two New Predator 16 GB Memory Kits: DDR4-4266 and DDR4-4600
HyperX has unveiled two new kits of DDR4 memory from its Predator range, offering speeds of DDR4-4266 and DDR4-4600. The new kits come in 2 x 8 GB sets...
10 by Gavin Bonshor on 4/25/2019
The G.Skill Royal Storage Box, Now On Sale: For All Your Royal Memories
Throughout the years we've seen the evolution of the Trident Z range from G.Skill which currently offers users with three different designs of DDR4 memory to choose from. This...
16 by Gavin Bonshor on 4/12/2019
Intel To Align 3rd Generation Optane DCPMM with DDR5: R&D in New Mexico
At Intel’s Data-Centric Innovation Day, Intel clarified with us where it sits in relation to its Optane DC Persistent Memory Strategy.
25 by Ian Cutress on 4/10/2019
Pricing of Intel’s Optane DC Persistent Memory Modules Leaks: From $6.57 Per GB
At least two retailers from the US on Friday have started to take pre-orders on Intel’s Optane DC Persistent Memory modules and therefore had to reveal their prices. Today...
59 by Anton Shilov on 4/5/2019
Kingston Reveals DDR4-2933 Registered DIMMs for Cascade Lake-SP
Coinciding with the launch of Intel’s Xeon ‘Cascade Lake-SP’ platform, Kingston on Tuesday announced its new Server Premier registered DIMMs designed for the latest servers. The modules offer data...
1 by Anton Shilov on 4/2/2019
Samsung Develops Smaller DDR4 Dies Using 3rd Gen 10nm-Class Process Tech
Samsung has completed development of its 3rd-generation 10 nm-class manufacturing process for DRAM as well as the first 8 Gb DDR4 chip that uses the technology. The 1z-nm process...
28 by Anton Shilov on 3/21/2019
Samsung HBM2E ‘Flashbolt’ Memory for GPUs: 16 GB Per Stack, 3.2 Gbps
Samsung has introduced the industry’s first memory that correspond to the HBM2E specification. The company’s new Flashbolt memory stacks increase performance by 33% and offer double per-die as well...
25 by Anton Shilov on 3/20/2019
Samsung Begins Mass Production of 12 GB LPDDR4X for Smartphones
Samsung said late on Wednesday that it had started volume production of 12 GB LPDDR4X-4266 memory for high-end smartphones. The chip is the highest-density DRAM for mobile applications. The...
19 by Anton Shilov on 3/14/2019
SK Hynix Details DDR5-6400
SK Hynix this week revealed some additional technical details about its upcoming DDR5-6400 memory chip at the International Solid State Circuits Conference. The die size of the company’s 16...
10 by Anton Shilov on 2/26/2019
Advantech Unveils 32 GB SQRAM DDR4 DIMMs for HPC
Advantech, a maker of server-grade memory, storage, and other components and solutions, is introducing a new lineup of 32 GB unbuffered DDR4 memory modules. Designed for high-performance computing (HPC...
7 by Anton Shilov on 2/13/2019
Corsair 192 GB DDR4 kits for W-3175X Listed Online: Up to $3000
Corsair has released a range of 192 GB DDR4 kits to complement the workstation-focused Intel Xeon W-3175X processor which features 28 cores. The top kit from the new line-up...
9 by Gavin Bonshor on 2/12/2019
Keysight Reveals DDR5 Testing & Validation System
Keysight, an electronic measurement company, has introduced the industry’s first off-the-shelf testing and validation system for DDR5 DRAM. The N6475A DDR5 Tx compliance test software is aimed at developers...
23 by Anton Shilov on 2/6/2019
G.Skill Unveils Trident Z Royal Hexa-Channel 192 GB DDR4-4000 Kit for Xeon W-3175X
G.Skill has released the industry’s first hexa-channel DDR4 memory kits designed specifically for Intel’s 28-core Xeon W-3175X processor for extreme workstations. The top-of-the-range kit features a 192 GB capacity...
15 by Anton Shilov on 1/30/2019
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