Last Thursday in its annual Investor Meeting Intel revealed the first details of its 3D NAND technology and announced that it will begin the shipments of 3D NAND in the second half of 2015. While Intel's investment in 3D NAND hasn't been a secret, the company has been relatively quiet about any specifics and the vital specs such as the number of layers and die capacity have remained unknown. In Thursday's webcast, Rob Crooke, Senior VP and General Manager of Intel's non-volatile memory group, disclosed that Intel's first generation 3D MLC NAND die will be 256Gbit (32GB) in capacity and will consist of 32 layers. The technology also enables a 384Gbit (48GB) TLC (3-bit-per-cell) die as we have learned over the years. Intel claims that...

Samsung SSD 845DC EVO/PRO Performance Preview & Exploring IOPS Consistency

Traditionally Samsung's enterprise SSDs have only been available to large server OEMs (e.g. Dell, EMC, and IBM). In other words, unless you were buying tens of thousands of drives...

30 by Kristian Vättö on 9/3/2014

Testing Samsung 850 Pro Endurance & Measuring V-NAND Die Size

Last week Samsung announced the 850 Pro, which is the first mainstream SSD to utilize 3D V-NAND. We already reviewed the drive and covered the fundamentals of V-NAND in...

36 by Kristian Vättö on 7/7/2014

Samsung SSD 850 Pro (128GB, 256GB & 1TB) Review: Enter the 3D Era

Over the last three years, Samsung has become one of the most dominant players in the SSD industry. Samsung's strategy has been tight vertical integration ever since the beginning...

152 by Kristian Vättö on 7/1/2014

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