Motherboard Features & Thermal Design

The unique nature of the BIS-6922 is evident in the chassis design. While other fanless PCs such as the Aleutia Relia go in for a rectangular design with hard edges and fins to blend in with it, the Habey fanless unit opts for a curved design on either side. The chassis is made to act as a heat sink and the circular metal segments on either side are serrated. This gives more surface area for heat to dissipate compared to the rectangular fins found in other fanless configurations. Habey terms this 'ICE-FIN'. It also delivers a distinctive look to the unit.

The BIS-6922 has no ventilation holes. Even the power button in the front panel is protected by a sealed plastic cap on the rear side of the front panel. This makes the unit almost fully dust-proof. Despite the dust-proof nature, the unit is very easy to take apart. The underside panel is held by only one screw, It provides access to a mini-PCIe and SIM card slot (for 3G / 4G data connectivity).

The ridged top panel can be easily removed to reveal the heat dissipation mechanism. The 2.5" disk drive is mounted on the underside of this top panel. The top panel has a groove on each side which lines up with similar grooves on the sides of the chassis. We have liberal thermal paste applied to copper heat pipes that are placed in the grooves to improve the thermal conductivity between the chassis sides and the top panel.

After disconnecting the SSD wires from the motherboard, it is possible to completely remove the top panel from the main chassis. This enables us to get a better view of the thermal solution and also some interesting motherboard features. These include PCIe / PCI lanes brought out to the edge of the motherboard (which is unfortunately not usable with the BIS-6922's chassis configuration) and an additional mPCIe slot for a Wi-Fi/BT card or mPCIe SSD. An mSATA port is also available. One of the two SODIMM memory modules (Super Talent / DDR3-1333) is also visible (The other one is partially visible after removing the panel on the bottom).

The motherboard is based on the QM77 chipset. This provides various features targeting business, embedded and industrial PC applications including Intel AMT and support for vPro processors amongst other features.

The CPU and PCH are placed on the motherboard in such a way that a single rectangular block of metal covers both of them. The block has two grooves out of which copper heat pipes swathed in thermal paste emerge to make contact with the inner sides of the chassis (one heat pipe to each side). The contact of these heat pipes with the sides is firmed up thanks to another set of smaller metal blocks. Compared to the heat pipes with a liberal number of bends in the Aleutia Relia, the thermal design configuration of the BIS-6922 is very simple and straightforward. Does this design lead to better thermal performance? Before finding that out, let us take a look at the performance numbers and power consumption of the unit.

Introduction Performance Metrics
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  • coolhardware - Tuesday, August 13, 2013 - link

    Crazy that they included a power supply not rated to meet max consumption, otherwise it seems like a nice industrial machine! Reply
  • DanNeely - Tuesday, August 13, 2013 - link

    Assuming the 68W measured number was wall power it was probably in spec; at 88% efficiency 68W in provides 60W out and peak efficiencies are near 50% at full load it''ll fall off some. It the brick was a cheap low efficiency model it might only have been putting out 50-55W at that point. Reply
  • Samus - Tuesday, August 13, 2013 - link

    I've used a 60w power brick on my A6-5400K system for nearly a year. Like all of them, it is a cheap Chinese brand, but it works. It does get hot, but I never pull 60w from a system where the CPU itself is rated at 65w alone. If you include motherboard overhead (chipset, memory) and SSD/optical drive (yes, it has both) the system should theoretically pull 90w.

    But it doesn't. I have a killowatt and it idles around 18w and never goes over 50w while playing back video. Even during Bluray playback it stays under 50w.
    Reply
  • flyingpants1 - Tuesday, August 13, 2013 - link

    Congratulations. They still should have shipped a larger brick. Reply
  • g00ey - Wednesday, August 14, 2013 - link

    That's a ... very, very ... E-X-O-T-I-C word for 'power supply'. You know, I shit bricks sometimes, perhaps I should become their supplier... Reply
  • JSStewart - Thursday, August 15, 2013 - link

    You should certainly do what you are best qualified for... Reply
  • flyingpants1 - Friday, August 16, 2013 - link

    Maybe you already are. That would explain a lot. Reply
  • alex_alfanet - Friday, August 16, 2013 - link

    What I found interesting is that the system was tested with a 45W TDP CPU but in the specs says that supports up to 35W TDP CPUs and in the Datasheet also says that Power Design Supports up to 35W CPUs. Requiring 10W less translates into a cooler systems and the 60 W power supply should be ok. I found that i7-3612QM and i7-3632QM are 35W TDP CPUs with Tj 105 °C Reply
  • kylewat - Wednesday, August 14, 2013 - link

    I just purchased a PoE router from ubiquiti made to power their 48V PoE+ access points, they include a 24V power brick, 48V brick not included. Reply
  • Dentons - Tuesday, August 13, 2013 - link

    The external case reaching 155 deg F presents a definite safety issue. That's hot enough to burn skin.

    Something reaching that temperature in a work environment would very likely need big warning labels or more likely, be enclosed in a cage to protect workers from incidental contact.

    Clearly, this is not for home users. It's hard to imagine a computing product with external case temp of 155 being approved for any consumer, home use.
    Reply

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