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DFI LANParty UT ICFX3200-T2R: ATI's, err, AMD's RD600 finally arrives
DFI LANParty UT ICFX3200-T2R: ATI's, err, AMD's RD600 finally arrives
Date: December 16th, 2006
Topic: Motherboard
Manufacturer: DFI
Author: Gary Key
 
 

DFI LANParty UT ICFX3200-T2R Basic Features

DFI LANParty UT ICFX3200-T2R/G
Market Segment: High-End Performance - $229.99
CPU Interface: Socket T (Socket 775)
CPU Support: LGA775-based Pentium 4, Celeron D, Pentium D, Pentium EE, Core 2 Duo, Core 2 Extreme
Chipset: AMD RD600 + SB600
Bus Speeds: Auto, 0 to 511 in 1MHz Increments
Memory Speeds: Auto, Sync, 133, 166, 200, 266, 333, 400, 533
Memory Frequency: 133MHz~658MHz in various Increments
PCIe Speeds: Auto, 100MHz~200MHz in 1MHz Increments
NB Strap: Auto, 100, 133, 166, 200, 266, 300, 333
Core Voltage: Auto, .44375V to 1.60000V in 0.00625V increments
Core Voltage Add: Auto, 100.01% ~ 121.25%
CPU VTT Voltage: 1.21V ~ 1.59V
CPU Clock Multiplier: Auto, 6x-11x in 1X increments if CPU is unlocked, downwards unlocked, Core 2 Duo
DRAM Voltage: Auto, 1.50V ~ 3.01V in various Increments
DRAM Timing Control: Auto, 18 DRAM Timing Options
NB Core 1.2V Voltage: 1.30V~2.18V
NB PLL 1.2V: 1.83V ~ 2.51V
NB PLL 1.8V: 1.21V ~ 1.46V
NB PCI-E Voltage: 1.22V ~ 1.60V
SB Core Voltage: 1.23V ~ 1.59V
Memory Slots: Four 240-pin DDR2 DIMM Slots
Dual-Channel Configuration
Regular Unbuffered Memory to 8GB Total
Expansion Slots: 3 - PCIe X16 (2 - x8 electrical, 1 - x2 electrical)
3 - PCI Slot 2.3
Onboard SATA/RAID: 4 SATA 3Gbps Ports - AMD SB600
(RAID 0,1, 0+1,JBOD)
4 SATA 3Gbps Ports - Promise PDC40719 (PCI Bus)
(RAID 0,1, 0+1, 5, JBOD)
Onboard IDE: 1 ATA133/100/66 Port (2 drives) - AMD SB600
Onboard USB 2.0/IEEE-1394: 10 USB 2.0 Ports - 6 I/O Panel - 4 via Headers
2 Firewire 400 Ports by VIA VT6307 - 1 I/O Panel, 1 via Header
Onboard LAN: Marvell Ethernet Controllers - PCI Express - 88E8052/88E8053
Onboard Audio: Karajan Audio Module - Realtek ALC885 - 8-channel HD audio codec
Power Connectors: ATX 24-pin, 8-pin EATX 12V
I/O Panel: 1 x PS/2 Keyboard
1 x PS/2 Mouse
1 x Serial Port
1 x S/PDIF Coaxial - In
1 x S/PDIF Coaxial - Out
1 x IEEE 1394a
1 x Audio Panel
2 x RJ45
6 x USB 2.0/1.1
BIOS Revision: Award 12/01, 12/07
Board Revision: 1.01

In typical DFI LANParty UT fashion, the amount of BIOS tweaks available to fine tune the performance of this board is incredible. Our chart does not do justice to all of the BIOS settings available but rest assured the performance enthusiast will think they are in a winter wonderland. On the flip side, the sheer number of options can be overwhelming for some, but we found the majority of auto settings provided a very good level of base performance. This held true in most areas except on the memory side where it was best to switch to manual settings and change the tCAS, tRCD, tRP, tRAS, and the command timing rates at a bare minimum. The performance results generated from this board are directly attributable to your choice of memory and capability to fine tune each individual setting to extract the best performance possible. We will delve into this subject in our full review along with detailed BIOS screenshots of our final setup choices for each memory speed. That said, the best attribute of this chipset and BIOS design is the almost infinite flexibility you have in separately controlling your FSB and memory speeds.

Click to enlarge

The board layout that DFI settled on is very good for the high-end enthusiast who utilizes alternative cooling solutions. The CPU area is clutter free due to the use of a six phase digital PWM power delivery system and offset with the intention that water or phase based cooling solutions will be used. We will include pictures of our case installation and that of several aftermarket heatsinks we utilized during testing shortly. In smaller ATX cases, most large air coolers such as the Scythe Infinity will have trouble fitting. Our Tuniq 120 had the best clearance in the midrange cases of all the large air coolers. The RD600 is cooled by a large passive heatsink that was well suited for the job until we started overclocking the FSB past 450. Due to the Northbridge voltage required to reach the maximum 511 FSB, the stock heatsink will require airflow over it. We would have preferred to replace the heatsink during this type of overclocking but DFI utilized the four hook attachment system that left us very little choice other than to direct airflow over the stock unit with an extra fan at this time.

The PCI Express and PCI slot arrangements are designed with multiple graphics card operation in mind but this layout will mean the removal of your primary graphics card if you need to switch memory. The board includes six fan headers, three of which can be controlled in the BIOS or by the included ITE Guardian utility. Other nice touches include the onboard power and reset buttons along with a diagnostic LED display. You can clear the CMOS by using the jumper or by simultaneously holding down the reset and power buttons for four seconds. If the board is in a case this same procedure can be completed by holding down the front panel reset and power buttons. DFI also includes the new AMD System Manager that allows you to change voltages, memory, and FSB values within Windows.

The Karajan audio module is plugged into a socket located on the motherboard near the I/O panel and features the Realtek ALC885 which we found to offer very good sound, but EAX compatibility is still needs improvement. The board also features two Marvell PCI-E based Gigabit Ethernet controllers that can be teamed together through a new Marvell software utility. We are still testing this capability but overall the Marvell controllers provide good throughput and CPU utilization numbers. Also included are four SATA 3Gb/s ports via the SB600, four additional SATA 3Gb/s ports from the PCI based Promise PDC40719 controller, a single Ultra ATA 133 IDE port supporting two IDE devices, FireWire 400 support from the VIA VT6307, three PCI slots, and three PCI Express x16 slots that are configured dual x8 (x16 for single card in the first slot) and single x2 electrically.

The third x16 slot is designed for the upcoming ATI/AMD physics capability. This slot can be jumpered for PCI Express card operation and we are testing it currently. Unfortunately, at this time it appears the secondary x16 slot can only be used for graphics. Ideally, we would like to be able to use any PCI-E device in any of the PCI-E slots, but it seems many of the chipset designs are taking a limited view of how PCI-E slots should be used - and this isn't just a problem with RD600 boards; most motherboards do not allow the use of non-graphics devices in the x16 slots.

Testing and Overclocking   Next Page

 
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42 Comments - Last by mino, 1067 days ago
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Why, WHY, did DFI use that retention mechanism on the chipset? by RichUK, 1070 days ago
If the chipset requires high voltage then fair enough. But at least allow us to upgrade the heatsink on the chipset. Due to the design, I don’t quite see any other aftermarket heatsink that will fit its profile. I would have wished they used a design similar to the way Asus fix their heatsink assembly to the board.

Or they could have just used an active cooling solution!

With all that put aside, I’ll still be purchasing this board as soon as I can!

Hopefully DFI won’t take long in releasing a BIOS that allows upwards of 500+ FSB from the BIOS. I want to get the max performance from my E6300!

I also don’t understand why they’re having so many issues with the BIOS coding :S

Reply
RE: Why, WHY, did DFI use that retention mechanism on the chipset? by yacoub, 1070 days ago
Actually most folks will be extremely pleased to see DFI finally move away from the godawful mobo chipset mini-fans. Those dinky fans are noisy and generally die very young . They cause more trouble than they're worth (hence why you see the vast majority of motherboards today have moved to passive cooling / heatpipe setups). Not only is a heatpipe setup quieter, it's also much lower maintenance.

Reply
RE: Why, WHY, did DFI use that retention mechanism on the chipset? by Griswold, 1069 days ago
Active cooling? Been to the official DFI forums lately? People dont want active chipset cooling if it can be avoided.

Reply
RE: Why, WHY, did DFI use that retention mechanism on the chipset? by RichUK, 1069 days ago
quote:

Active cooling? Been to the official DFI forums lately? People dont want active chipset cooling if it can be avoided.


Neither do I.

However, if you’re required to further cool the chipset when under high voltage to obtain a higher FSB. Then maybe a better solution could have been implemented in the first place.

I thought I made that quite clear.


Reply
RE: Why, WHY, did DFI use that retention mechanism on the chipset? by Lord Evermore, 1069 days ago
Why increase cost for everyone, and add more complexity and provide an opportunity for a higher failure rate, to add a feature that many people might not want or need, and which likely will be a detraction from the quality of the board to many people? People don't like fans on chipsets, period. There was a phase of those for a few years being used on every board, even if the chipset didn't particularly need it, and all that happened is people complained about fans failing, whiny noisy fans, dust collection, etc.

Reply
RE: Why, WHY, did DFI use that retention mechanism on the chipset? by Goty, 1069 days ago
I think a good solution to this would be to include an <i>optional</i> fan for cooling the NB.

Reply
RE: Why, WHY, did DFI use that retention mechanism on the chipset? by Lord Evermore, 1069 days ago
That'd make the price even higher, since they'd be including a heatsink designed to work well on its own, as well as either a fan alone, or a heatsink fan assembly if the standard heatsink isn't designed for airflow with attached, or with no way to attach it.

The solution is for people to screw a fan on the chipset if they want extra cooling beyond what is actually quite a high overclock with the standard heatsink.

However DFI could still have used a more standard and easily replaced retention mechanism. Of course there's always still thermal tape, epoxy or zip ties.

Reply
RE: Why, WHY, did DFI use that retention mechanism on the chipset? by RichUK, 1068 days ago
You seem to have missed the focus point of my initial comment. I didn’t insist DFI implement an active cooling solution, rather a more adequate solution.

Atleast you somewhat agree with my original immediate argument:

quote:

However DFI could still have used a more standard and easily replaced retention mechanism. Of course there's always still thermal tape, epoxy or zip ties.


I never wanted an active cooling solution, never. However, I had hoped DFI would implement a solution that would exceed the requirements for cooling this chipset. Hopefully this point will be moot when I receive my board, and when I receive my board I won’t have to do any sort of cooling modding.


Reply
Needs moar FSB by Avalon, 1070 days ago
511FSB max for $229 doesn't sound that impressive to me. I can get a $110 Biostar 965PT to do that. Hopefully a newer BIOS will allow much higher FSB clocks. Nevertheless, I don't think this board will be for me anymore.

Reply
RE: Needs moar FSB by cmdrdredd, 1070 days ago
Who says 511 is max? Also who said it wasn't a limitation of the CPU or other components not being able to do that type of FSB?

Reply
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