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  • plopke - Friday, July 14, 2017 - link

    MOOOOOOOOOOORE, MOOOOOOOORE and DDR4 to drop prices plz Reply
  • SofiaRogers - Saturday, July 22, 2017 - link

    I resigned my office-job and now I am getting paid 85 bucks hourly. How? I work over internet! My old work was making me miserable, so I was forced to try something different, two years after...I can say my life is changed-completely for the better!

    this is what i do....
  • Santoval - Friday, July 14, 2017 - link

    Where is wire bonding of "conventional" 3D NAND applied, between the edges of the dies? And are the wires really vertical like TSVs or do they curve somewhat around these edges (though I understand that any curve at such extremely close distances would probably be negligibly tiny)? If I've understood correctly wire bonding never pierces the dies at any point, not even at the edges, correct? Reply
  • Ryan Smith - Saturday, July 15, 2017 - link

    Correct. Wire bonding is always bonding at the edge. Reply
  • Billy Tallis - Saturday, July 15, 2017 - link

    See pictures at and at

    Wire-bonded die stacks are staggered so that the edges with the contacts are exposed. 16-die stacks typically are packaged as two 8-die stacks with the upper half rotated 180 degrees.
  • LuckyWhale - Friday, July 14, 2017 - link

    The end draws ever closer for the traditional rotating HDDs. Reply

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