Testing Methodology

For testing Micro-ATX and full ATX cases, we use the following standardized testbed in stock and overclocked configurations to get a feel for how well the case handles heat and noise.

ATX Test Configuration
CPU Intel Core i7-2700K
(95W TDP, tested at stock speed and overclocked to 4.3GHz @ 1.38V)
Motherboard Gigabyte GA-Z68MX-UD2H-B3
Graphics Card ASUS GeForce GTX 560 Ti DCII TOP
(tested at stock speed and overclocked to 1GHz/overvolted to 1.13V)
Memory 2x2GB Crucial Ballistix Smart Tracer DDR3-1600
Drives Kingston SSDNow V+ 100 64GB SSD
Samsung 5.25" BD-ROM/DVDRW Drive
Accessories Corsair Link
CPU Cooler Cooler Master Hyper 212 Evo with Cooler Master ThermalFusion 400
Power Supply SilverStone Strider Plus 750W 80 Plus Silver

Each case is tested in a stock configuration and an overclocked configuration that generates substantially more heat (and thus may produce more noise). The system is powered on and left idle for fifteen minutes, the thermal and acoustic results recorded, and then stressed by running seven threads in Prime95 (in-place large FFTs) on the CPU and OC Scanner (maximum load) on the GPU. At the end of fiteen minutes, thermal and acoustic results are recorded. This is done for the stock settings and for the overclock, and if the enclosure has a fan controller, these tests are repeated for each setting. Ambient temperature is also measured after the fifteen idle minutes but before the stress test and used to calculate the final reported results.

Thank You!

Before moving on, we'd like to thank the following vendors for providing us with the hardware used in our testbed.

Assembling the In-Win GRone Noise and Thermal Testing, Stock
POST A COMMENT

31 Comments

View All Comments

  • pdjblum - Tuesday, September 18, 2012 - link

    I would so much appreciate if you could list the materials in the spec list,. Cases made out of aluminium are not the same as those made out of other materials., so knowing the material is important., Reply

Log in

Don't have an account? Sign up now