Intel's Medfield & Atom Z2460 Arrive for Smartphones: It's Finally Here
by Anand Lal Shimpi on January 10, 2012 8:00 PM ESTThe GPU
The PowerVR SGX 540 in Medfield is no different from what you'd get in an OMAP 4460, with the exception that it's clocked a bit higher at 400MHz.
The SGX 540 here is a remnant of Intel's earlier strategy to have Medfield out far sooner than it actually is going to show up on the market. Thankfully Intel has plans to introduce a PowerVR SGX 543MP2 based Medfield successor also before the end of the year.
Video Decode/Encode Support, Silicon Hive ISP
Intel relies on two more IP blocks from Imagination Technologies: the VDX385 and VDE285 for 1080p video decode and encode. Intel claims support for hardware accelerated 1080p30 decode, High Profile. Maximum supported bitrate is apparently up to 50Mbps, although Intel only demonstrated a 20Mbps High Profile stream:
Intel also claims support for 1080p30 video encode.
Medfield's ISP is provided by Intel owned Silicon Hive. The ISP supports cameras ranging from 5MP to 16MP (primary sensor), with the reference design standardizing on an 8MP sensor. Medfield supports burst capture at up to 15 fps (8MP).
The Process
Intel bifurcated its process technology a few years ago, offering both low power and high performance versions of each of its process nodes. Today those process nodes are staggered (45nm LP after high perf 32nm, 32nm LP debuts after high performance 22nm, etc...) however Intel plans on bringing both in lockstep.
Medfield debuts on Intel's 32nm LP process. The only details we have from Intel are that leakage is 10x lower than the lowest on 45nm. Compared to Moorestown, Medfield boasts 43% lower dynamic power or 37% higher frequency at the same power level.
The bigger and more valid comparison is to TSMC's 28nm process, which is what companies like Qualcomm will be using for their next-generation SoCs. It's unclear (and very difficult) to compare different architectures on different processes, but it's likely that Intel's 32nm LP process is more comparable to TSMC's 28nm LP process than it would be to any 4x-nm node.
It is important to note that Intel seems very willing to sacrifice transistor density in order to achieve lower power consumption where possible. I don't believe Intel will have the absolute smallest die sizes in the market, but I also don't believe it's clear what the sweet spot is for mobile SoCs at this point. It's quite likely that Apple's ~120mm^2 target is likely where everyone will eventually end up in the near term.
The Roadmap
Although Medfield is already posting competitive performance numbers, its current competition is roughly a year old. Within the next two quarters we'll see smartphones and tablets shipping based on Qualcomm's Krait. The next-generation Snapdragon platform should be Cortex A15-like in its performance level
Today we have Medfield, a single core Atom paired with a PowerVR SGX 540 built on Intel's 32nm LP process. Before the end of the year we'll see a dual-core Atom based Medfield with some form of a GPU upgrade. I wouldn't be too surprised to see something like a PowerVR SGX 543MP2 at that point either. In tandem Intel will eventually release an entry level SoC designed to go after the more value market. Finally we'll see an Intel Atom based SoC with integrated Intel baseband from its Infineon acquisition - my guess is that'll happen sometime in 2013.
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Hector2 - Wednesday, January 11, 2012 - link
So you doubt Anand's power measurements too ?As for the DX11 demo, Intel's VP showed very poor judgement running a video when they had trouble getting the demo out in time -- that's a major screw up, but Anand showed that the hardware actually works in spite of the screwed up demo.
french toast - Thursday, January 12, 2012 - link
No i dont doubt Anands Integrity or his benchmarks, i have just questioned his optimistic assuptions on un proven Intel hardware, especially when Intel produced the scope and the power benchmarks.All of which compare last years hardware, all the Intel sorced benches are single threaded and are likely due to Intel software optimisations, and lastly because the atom is higher clocked.
The benches as exophase has pointed out are on things that the cpu is not loaded/stressed.
Its great he has provided us with an insight, but this in no way proves that this architecture is the best nor does it prove that it would have 'dominated' android devices last year for a whole number of reasons that i cant be bothered to re-type.
Anand has jumped the gun on his conclusions thats all im saying
Dark_Archonis - Tuesday, January 10, 2012 - link
Time for the haters to eat their words, and the ARM supporters to admit they were wrong.On the forums there were enough self-proclaimed "experts" that claimed Intel was doomed and that ARM would take over. Well who's laughing now? Here we see an Atom SoC, that has power characteristics EQUAL or BETTER THAN ARM SoCs, while posting very strong performance as well. This is keeping in mind that it is just the first step for Intel in the smartphone market.
ARM supporters are already claiming that Medfield only looks good because it's being compared to year-old ARM designs. But guess what, the Atom design is 5 years old! Yes, this is a new SoC for Intel, but the fact is Intel must be given HUGE credit that they were able to make an SoC based on the 5-year old Atom design that is extremely competitive in power and performance to ARM SoCs.
Next-gen ARM designs will arrive later this year yes, but Intel will not stand still either. Also lets not forget about the next-gen Atom that will come in 2013 on the 22nm process. That will be a HUGE leap forward for Intel and will put them in an extremely competitive position against any quad-core ARM SoCs.
DigitalFreak - Tuesday, January 10, 2012 - link
You want a cookie or something? No-one cares about your fanboy rant.Dark_Archonis - Tuesday, January 10, 2012 - link
Obviously you cared enough to login, and make a useless, childish post devoid of anything meaningful, instead of actually replying to what I had posted.Great job at proving yourself wrong.
name99 - Wednesday, January 11, 2012 - link
Dude, the reason he is (justifiably) mocking you is that you are comparing ARM silicon that is shipping TODAY with Intel silicon that will be shipping in a YEAR.That's how it works among adults --- you compare shipping with shipping, not what I plan to ship (one day) with what you plan to ship (one day).
guilmon19 - Tuesday, January 10, 2012 - link
Except that Medfield is built on a 32nm process while ALL available A9s out there are built on the 45nm process. If the A9's were 32nm as well these benchmarks would be very different and these benchmarks came straight from intel, lets way wait till we actually get the phone and do benchmarks from there to determine which one is better.madmilk - Tuesday, January 10, 2012 - link
Doesn't matter than Medfield is 32nm, by the time anyone else makes a 32nm SoC Intel will be on 22nm.It's a massive advantage that can't just be thrown away, especially if trying to make a fair comparison.
Exophase - Tuesday, January 10, 2012 - link
Hardly, TSMC 28nm ARM processors are right around the corner while 22nm Atoms won't hit until 2013. Intel's doesn't yet have the same process advantage with their LP SoC nodes.Dark_Archonis - Tuesday, January 10, 2012 - link
Your point being? Even looking at TSMC's 28nm process, Intel will still have quite an advantage with their 22nm process. ARM will only have an advantage for a few quarters with the 28nm process, then Intel will come out with their 22nm process. You also fail to acknowledge that Atom on 22nm (Silvermont) will a brand new Atom architecture, which you can bet will be a HUGE leap forward in performance and power efficiency.TSMC is well known for having lots of trouble moving to new a process. Exophase, you should rephrase "right around the corner" to say in 1-2 quarters at the very least. It will still be a few months before we see any 28nm ARM phones actually on the market.
Intel has aligned their mobile and desktop process roadmaps, so all future Atoms will move to a new process node as fast as Intel's desktop chips.
Intel will also have a technological advantage as their 22nm process introduces FinFET, while TSMC won't have FinFET until their 14nm process.
Furthermore, Intel intends to introduce 14nm in 2013/2014, while TSMC won't introduce 14nm until 2015.
Intel was really slow getting into the smartphone market, but now that they have their foot in the door, they will not let off the gas. Intel's efforts in the smartphone market will only accelerate from this point. Intel will attack ARM directly at the low-end power scale in this case, and ARM will struggle greatly at the high end as Intel's Haswell will offer revolutionary power/performance ratios. That's not even mentioning what power/performance ratios we will see from the the next-gen Atom design.
Also let me restate that this is Intel's *first step* into the smartphone market, and they are able to be very competitive with ARM designs.