Memory
Update 06/13: SK hynix has sent a note to AnandTech clarifying that the company "plans to start mass production of GDDR7 in the fourth quarter of this year when the relevant market opens up." This article has been updated accordingly. Being a major JEDEC memory standard, GDDR7 is slated to be produced by all three of the Big Three memory manufacturers. But it seems that not all three vendors will be kicking off mass production at the same time. SK hynix was at this year's Computex trade show, showing off their full lineup of memory technologies – including, of course, GDDR7. SK hynix is the last of the major memory vendor's we've seen promoting their memory, and fittingly, they seem to be the last in terms...
DDR5 Memory Specification Released: Setting the Stage for DDR5-6400 And Beyond
Marking an important milestone in computer memory development, today the JEDEC Solid State Technology Association is releasing the final specification for its next mainstream memory standard, DDR5 SDRAM. The...
89 by Ryan Smith on 7/14/2020_carousel.jpg)
PNY Unveils XLR8 Gaming Epic-X RGB DDR4-3200 Memory
Perhaps more widely known for its array of NVIDIA based graphics cards, American based company PNY has announced its latest product, the XLR8 Gaming Epic-X RGB DDR4 memory. Built...
27 by Gavin Bonshor on 7/14/2020
SK Hynix: HBM2E Memory Now in Mass Production
Just shy of a year ago, SK Hynix threw their hat into the ring, as it were, by becoming the second company to announce memory based on the HBM2E...
38 by Ryan Smith on 7/2/2020_carousel.jpg)
GeIL Unveils Orion Series Memory, Up to DDR4-4000 with 32 GB Memory Modules
GeIL has announced its newest family of DDR4 modules, the Orion series. Available in two versions, one standard and one for AMD platforms, the Orion series offers SKUs ranging...
7 by Gavin Bonshor on 6/11/2020
Patriot's New 32GB Modules Available: UDIMM up to DDR4-3600, SODIMM up to DDR4-3000
Patriot has released a new series of DDR4 32GB memory modules in its VIPER GAMING STEEL series, complementing the 32GB offerings of the Blackout series as well as for...
11 by Andrei Frumusanu on 6/9/2020
New ZADAK Twist DDR4 Memory, Up to DDR4-4133 and 256 GB
ZADAK has announced its latest range of DDR4 memory, the Twist series. Designed for users looking for a lower profile alternative to its previous memory brands, the Twist features...
7 by Gavin Bonshor on 5/6/2020
GeiL Unveils 64 GB DDR4-3200 SO-DIMM Kit, 2 x 32 GB
Memory manufacturer Golden Emporer International Limited, or known generally as GeiL, has announced its new memory line with support for Intel 10th Gen and AMD Ryzen 4000 series processors...
21 by Gavin Bonshor on 5/5/2020
XPG Spectrix D50 Memory: A More Subtle RGB DDR4
ADATA's XPG division has unveiled its latest addition in the high-performance DRAM segment, the Spectrix D50. Starting from 8 GB DDR4-3000 modules, the latest Spectrix D50 kits will go...
22 by Gavin Bonshor on 4/15/2020
ADATA's New 32 GB DDR4-3200 SO-DIMM, Ideal for Ryzen Mobile
ADATA, one of the leading manufacturers of DRAM and NAND products, has just unveiled its latest memory modules. The new ADATA DDR4-3200 32 GB parts are available in both...
41 by Gavin Bonshor on 4/15/2020
China Develops High Capacity QLC 3D NAND: YMTC at 1.33 Tb
Yangtze Memory Technologies Co. (YMTC) has announced that it's developed its new 128-layer 1.33 Tb QLC 3D NAND memory chip, the X2-6070. The new chip is based on its...
64 by Gavin Bonshor on 4/13/2020
SK Hynix: We're Planning for DDR5-8400 at 1.1 Volts
Back in November last year, we reported that SK Hynix had developed and deployed its first DDR5 DRAM. Fast forward to the present, and we also know SK Hynix...
86 by Gavin Bonshor on 4/3/2020
Micron to Start Volume Production of 128-Layer 3D NAND with RG Architecture This Quarter
As part of the company's second quarter financial earnings call, Micron has revealed that it is about to start volume production of its 4th Generation 3D NAND memory devices...
10 by Anton Shilov on 4/1/2020
Cadence DDR5 Update: Launching at 4800 MT/s, Over 12 DDR5 SoCs in Development
JEDEC still has not published the DDR5 specification officially, yet it looks like DRAM makers and SoC designers are preparing for the DDR5 launch at full steam. Cadence, which...
20 by Anton Shilov on 3/27/2020
TeamGroup Announces 32GB T-Force Vulcan Z and Dark Z DDR4 Modules
One of the world's largest DRAM memory manufacturers TeamGroup has unveiled its first DDR4 memory kits featuring 32 GB sticks under its gaming-focused T-Force brand. The T-Force Vulcan Z...
7 by Gavin Bonshor on 3/27/2020
Samsung to Produce DDR5 in 2021 (with EUV)
Samsung is on track to start volume production of DDR5 and LPDDR5 memory next year using a manufacturing technology that will take advantage of extreme ultraviolet lithography (EUVL). In...
20 by Anton Shilov on 3/25/2020
GlobalFoundries & Everspin Extend MRAM Pact to 12nm
GlobalFoundries and Everspin have announced that the two have extended their Spin-transfer Torque (STT-MRAM) joint development agreement (JDA) to 12LP (12 nm FinFET) platform. The extension will enable GlobalFoundries...
4 by Anton Shilov on 3/13/2020
Rambus Develops HBM2E Controller & PHY: 3.2 Gbps, 1024-Bit Bus
The latest enhancements to the HBM2 standard will clearly be appreciated by developers of memory bandwidth-hungry ASICs, however in order to add support of HBM2E to their designs, they...
42 by Anton Shilov on 3/6/2020
ATP’s DDR4-3200 Industrial DIMMs: Up to 128GB @ 1.2V for AMD & Intel
ATP has unveiled its latest memory modules for servers and industrial applications, boasting a 3200 MT/s data transfer rate, an industry-standard voltage, and capacities ranging from 2 GB to...
7 by Anton Shilov on 3/5/2020
Samsung Starts Production of 16 GB LPDDR5-5500 for Smartphones
Samsung has begun mass production of the industry’s first 16 GB LPDDR5 memory for upcoming smartphones, such as the Galaxy S20 Ultra 5G handsets. The new DRAM devices not...
33 by Anton Shilov on 2/25/2020
SMART Modular Reveals 32 GB DDR4-3200 Low Profile Mini-DIMMs for Extreme Environments
SMART Modular has unveiled a new lineup of 32 GB Mini-DIMMs for extreme environments, such as industrial or telecommunication applications. The new high-density modules come in ULP (Ultra Low...
7 by Anton Shilov on 2/14/2020
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