Semiconductors
As announced last week by TSMC, later this year the company is set to start high-volume manufacturing on its N3P fabrication process, and this will be the company's most advanced node for a while. Next year things will get a bit more interesting as TSMC will have two process technologies that could actually compete against each other when they enter high-volume manufacturing (HVM) in the second half of 2025. Advertised PPA Improvements of New Process Technologies Data announced during conference calls, events, press briefings and press releases Compiled by AnandTech TSMC N3 vs N5 N3E vs N5 N3P vs N3E N3X vs N3P N2 vs N3E N2P vs N3E N2P vs N2 A16 vs N2P Power -25% -30% -34% -5% -10% -7%*** -25% -30% -30% -40% -5% -10% -15% -20% Performance +10% +15% +18% +5% +5% Fmax @1.2V** +10% +15% +15% +20% +5 +10% +8% +10% Density* ? 1.3x 1.04x 1.10x*** 1.15x 1.15x ? 1.07x 1.10x HVM Q4 2022 Q4 2023 H2 2024 H2 2025 H2 2025 H2 2026 H2 2026 H2 2026 *Chip density published by TSMC reflects 'mixed' chip density consisting of 50% logic, 30% SRAM, and 20% analog. **At the same area. ***At the same speed. The production nodes are N3X (3nm-class, extreme performance-focused) as well as N2 (2nm-class). TSMC says...
TSMC Solidifies Leadership on Foundry Market as Intel Jumps into Top 10
The global foundry industry witnessed a substantial rise in demand in the third quarter of 2023, according to TrendForce. The Top 10 foundries collectively saw their revenue soar to...
7 by Anton Shilov on 12/6/2023
Amkor to Build $2 Billion Chip Packaging Fab in Arizona Primarily for Apple
Amkor, the world's second largest independent outsourced semiconductor assembly and test (OSAT) service provider, has announced their intention to build a new advanced chip packaging facility in the U.S...
12 by Anton Shilov on 12/4/2023
Samsung's Next-Gen 3nm and 4nm Nodes on Track for Mass Production in 2H 2024
Samsung is set to start making chips using its 2nd Generation 3nm-class (SF3) manufacturing technology as well as performance-enhanced version of its 4nm-class (SF4X) fabrication process in the second...
9 by Anton Shilov on 11/2/2023
TSMC Q3 Earnings: 3nm Production Node Accounts for 6% of Revenue
Although Taiwan Semiconductor Manufacturing Co. formally started production of chips using its N3 (3nm-class) process technology back in late 2022, the company did not recognize any meaningful N3 revenue...
7 by Anton Shilov on 10/19/2023
Canon Prepares Nanoimprint Lithography Tool To Challenge EUV Scanners
Canon has recently revealed its FPA-1200NZ2C, a nanoimprint semiconductor manufacturing tool that can be used to make advanced chips. The device uses nanoimprint lithography (NIL) technology as an alternative...
14 by Anton Shilov on 10/17/2023
TSMC: We Want OSATs to Expand Their Advanced Packaging Capability
Almost since the inception of the foundry business model in the late 1980s, TSMC would produce silicon. In contrast, an outsourced semiconductor assembly and test (OSAT) service provider would...
2 by Anton Shilov on 10/16/2023
TSMC: Ecosystem for 2nm Chip Development Is Nearing Completion
Speaking to partners last week as part of their annual Open Innovation Platform forum in Europe, a big portion of TSMC's roadshow was dedicated to the next generation of...
20 by Anton Shilov on 10/12/2023
Samsung Lines Up First Server Customer For 3nm Fabs
Although Samsung Foundry was the first contract fab to formally start mass production of chips on a 3 nm-class process, so far, the company's latest process has largely been...
5 by Anton Shilov on 10/12/2023
TSMC: Importance of Open Innovation Platform Is Growing, Collaboration Needed for Next-Gen Chips
This year TSMC is commemorating 15 years of its Open Innovation Platform, a multi-faceted program that brings together the foundry's suppliers, partners, and customers to help TSMC's customers better...
4 by Anton Shilov on 10/12/2023
GlobalFoundries Applies for CHIPS Money to Expand U.S. Fabs
Update 9/30: Correcting the number of companies interested in receiving support from the CHIPS fund. GlobalFoundries has applied for financial support from the U.S. CHIPS and Science Act to expand...
3 by Anton Shilov on 9/26/2023
TSMC Buys 10% Stake in IMS Nano from Intel
Intel and TSMC have announced an agreement in which TSMC will acquire a 10% stake in IMS Nanofabrication. IMS, controlled by Intel, produces multi e-beam photomask writing tools, whose...
0 by Anton Shilov on 9/12/2023
TSMC: Short Supply of HPC GPUs to Persist for 1.5 Years
The reports about an insufficient supply of compute GPUs used for artificial intelligence (AI) and high-performance computing (HPC) servers became common in recent months as demand for GPUs to...
6 by Anton Shilov on 9/7/2023
ASML to Deliver First High-NA EUV Tool This Year
In a promising sign for the development of the next generation of EUV lithography machines, ASML has revealed that the company is set to deliver the industry's first High-NA...
7 by Anton Shilov on 9/6/2023
Intel Foundry Services to Make 65nm Chips for Tower Semiconductor
In quite an unexpected turn of events, Intel on Tuesday announced that its foundry division would produce chips for contract chip maker Tower Semiconductor. Tower was a previous acquisition...
9 by Anton Shilov on 9/5/2023
Intel Calls Off Tower Acquisition, Forced to Focus Solely on Leading-Edge Nodes
Intel Corp. will not proceed with its $5.4 billion deal to acquire Tower Semiconductor foundry due to a lack of regulatory approval from China, the two companies announced on...
17 by Anton Shilov on 8/17/2023
Intel and Synopsys Ink Deal to Develop IP for Intel's 3 and 18A Nodes
Intel and Synopsys this week signed an agreement under which Synopsys will develop a portfolio of various IP offerings for Intel 3 and 18A fabrication technologies for Intel Foundry...
1 by Anton Shilov on 8/15/2023
TSMC Establishes Joint Venture to Build 12nm/16nm Fab in Europe
TSMC on Tuesday announced plans to establish a European Semiconductor Manufacturing Company (ESMC) joint venture with its partners Bosch, Infineon, and NXP to build a fab near Dresden, Germany...
10 by Anton Shilov on 8/8/2023
Intel Plans Massive Expansion in Oregon: D1X and D1A to Be Upgraded
Intel has filed a permit application that outlines significant expansion plans for its campus near Hillsboro, Oregon. According to filings submitted to state regulators, the tech giant's ambitious proposals...
4 by Anton Shilov on 8/2/2023
China Imposes New Export Restrictions on Gallium and Germanium
China this week formally imposed new export regulations on gallium and germanium, as well as materials incorporating them. This move is broadly seen as a retaliatory act for the...
6 by Anton Shilov on 8/2/2023
Dozens of Companies Adopt TSMC's 3nm Process Technology
Designing chips for modern, leading-edge manufacturing technologies is an expensive endeavor. Still, dozens of companies have already adopted TSMCs N3 and N3E (3 nm-class) fabrication processes, according to disclosures...
9 by Anton Shilov on 7/28/2023
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