TSMC's 3D Stacked SoIC Packaging Making Quick Progress, Eyeing Ultra-Dense 3μm Pitch In 2027
TSMC's 3D-stacked system-on-integrated chips (SoIC) advanced packaging technologies is set to evolve rapidly. In a presentation at the company's recent technology symposium, TSMC outlined a roadmap that will take...
1 by yesterday
TSMC: Performance and Yields of 2nm on Track, Mass Production To Start In 2025
In addition to revealing its roadmap and plans concerning its current leading-edge process technologies, TSMC also shared progress of its N2 node as part of its Symposiums 2024. The...
4 by 2 days ago
Rapidus Adds Chip Packaging Services to Plans for $32 Billion 2nm Fab
To say that the global foundry market is booming right now would be an understatement. Demand for leading-edge process technologies driven by AI and HPC applications is unprecedented, and...
12 by on 5/24/2024
MSI Teases Z790 Project Zero Plus Motherboard With CAMM2 Memory Support
MSI on Thursday published the first image of a new desktop motherboard that supports the innovative DDR5 compression attached memory module (CAMM2). DDR5 CAMM2 modules are designed to improve...
8 by on 5/24/2024
TSMC's Roadmap at a Glance: N3X, N2P, A16 Coming in 2025/2026
As announced last week by TSMC, later this year the company is set to start high-volume manufacturing on its N3P fabrication process, and this will be the company's most...
46 by on 5/22/2024
TSMC Offers a Peek at 'Global Gigafab' Process Replication Program
At its European Technology Symposium last week TSMC revealed some of the details about its Global Gigafab Manufacturing program, the company's strategy to replicate its manufacturing processes across its...
11 by on 5/22/2024
TSMC to Expand CoWoS Capacity by 60% Yearly Through 2026
Customer demand for AI and HPC processors is driving a much greater use of advanced packaging technologies, particularly TSMC's chip-on-wafer-on-substrate (CoWoS) services. As things stand, TSMC is just barely...
8 by on 5/21/2024
TSMC Outlines Path to EUV Success: More Tools, More Wafers, & Best Pellicles In Industry
Although TSMC can't claim to be the first fab to use extreme UV (EUV) lithography – that title goes to Samsung – they do get to claim to be...
20 by on 5/17/2024
Not Dead Yet: WD Releases New 6TB 2.5-Inch External Hard Drives - First Upgrade in Seven Years
UPDATE 5/17, 6 PM: Western Digital has confirmed that the new 2.5-inch T GB HDDs uses 6 SMR platters The vast majority of laptops nowadays use solid-state drives, which is...
10 by on 5/16/2024
TSMC to Expand Specialty Capacity by 50%, Introduce 4nm N4e Low-Power Node
With all the new fabs being built in Germany and Japan, as well as the expansion of production capacity in China, TSMC is planning to extend its production capacity...
0 by on 5/16/2024
TSMC Readies Next-Gen HBM4 Base Dies, Built on 12nm and 5nm Nodes
Of the several major changes coming with HBM4 memory, one of the most immediate is the sheer width of the memory interface. With the fourth-generation memory standard moving from...
1 by on 5/16/2024
TSMC: Performance-Optimized 3nm N3P Process on Track for Mass Production This Year
As part of the second leg of TSMC's spring technology symposium series, the company offered an update on the state of its 3nm-class processes, both current and future. Building...
21 by on 5/15/2024
AMD Hits Record High Share in x86 Desktops and Servers in Q1 2024
Coming out of the dark times that preceded the launch of AMD's Zen CPU architecture in 2017, to say that AMD has turned things around on the back of...
44 by on 5/10/2024
Sabrent Launches Rocket Nano M.2-2242 SSD: Up to 5 GB/sec
Sabrent tends to get into news when it launches ultra-high-performance SSDs for enthusiast-grade desktops, but this week the company introduced a completely different type of product: a small form-factor...
4 by on 5/9/2024
Micron Ships Crucial-Branded LPCAMM2 Memory Modules: 64GB of LPDDR5X For $330
As LPCAMM2 adoption begins, the first retail memory modules are finally starting to hit the retail market, courtesy of Micron. The memory manufacturer has begun selling their LPDDR5X-based LPCAMM2...
13 by on 5/8/2024
ASUS to Unveil First Qualcomm Snapdragon X Elite-Based Laptop On May 20th
Asus on Tuesday said that it would announce its first 'AI PC' based on Qualcomm's Snapdragon X Elite system-on-chips later this month. The new laptop is set to be...
8 by on 5/7/2024
Samsung Tapes Out Its First 3nm Smartphone SoC, Gets A Boost From Synopsys AI-Enabled Tools
This week Samsung Electronics and Synopsys announced that Samsung has taped out its first mobile system-on-chip on Samsung Foundry's 3nm gate-all-around (GAA) process technology. The announcement, coming from electronic...
8 by on 5/3/2024
SK hynix Reports That 2025 HBM Memory Supply Has Nearly Sold Out
Demand for high-performance processors for AI training is skyrocketing, and consequently so is the demand for the components that go into these processors. So much so that SK hynix...
6 by on 5/2/2024
AMD Zen 5 Status Report: EPYC "Turin" Is Sampling, Silicon Looking Great
As part of AMD's Q1'2024 earnings announcement this week, the company is offering a brief status update on some of their future products set to launch later this year...
41 by on 5/1/2024
Samsung Foundry Update: 2nm Unveil in June, Second-Gen SF3 3nm Hits Production This Year
As part of Samsung's Q1 earnings announcement, the company has outlined some of its foundry unit's key plans for the rest of the year. The company has confirmed that...
4 by on 5/1/2024
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